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2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Screw driver
Hexagonal inserted handle box wrench
Diagonal cutting nippers
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Push release button by hand to separate monitor head and stand.
2.
Pull out hinge cover by hand to separate from monitor head.
3.
Use tool to release screws and get hinge part.
4.
Use tool to release screws and disassemble the rear cover by hand
5.
Use tool to separate LED-LEN parts from rear cover
6.
Tear Al-tape and acrylic adhesive tape off and separate FFC wire from connecter
7.
Use tool to release screws at top and bottom. Then get panel, assy-BZL, main-SHD parts.
8.
Take FFC wire off from panel.
9.
Take Ctrl BD off from assy-BZL.
10. Use tool to separate OSD-BTN, PWR-BTN, PWR-LEN parts from BZL. And use pin at back side to separate the logo.
11. Use tool to release screws on PCBs. Then tear down the gaskets on main-BKT and separate all connector on PCBs.
12. Release the screw by hand to disassemble stand.
13. Tear all rubbers and release screws on base
14. Release screws to disassemble assy-column.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Tool Size (if
applicable)
#2
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