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HP X27i Product End-Of-Life Disassembly Instructions

HP X27i Product End-Of-Life Disassembly Instructions

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Product End-of-Life Disassembly Instructions
Product Category: Monitors & Display
Marketing Name / Model
[List multiple models if applicable.]
HP X27i
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for
the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on
the plastic part. For any questions on plastic marking, please contact
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries, excluding Li-Ion batteries.
Li-Ion batteries. Include all Li-Ion batteries if more
than one is provided with the product (such as a
detachable notebook keyboard battery, RTC coin cell,
etc.)
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
HP's Sustainability
Notes
With a surface greater than 10 sq cm
I/F Board*1, SPS board*1, Control Board*1, Lens
Board*1
All types including standard alkaline, coin or button
style batteries
Battery(ies) are attached to the product by (check all
that apply with an "x" inside the "[ ]"):
[
] screws
[
] snaps
[
] adhesive
[
] other. Explain
NOTE: Add detailed removal procedures including
required tools in the sections 3.1 and 3.2.
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps Panel*1
C605 in SPS Board
HDMI cable*1, Power cord*1
All are inside monitor carton box
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Contact.
Quantity of
items
included in
product
4
0
0
0
1
0
0
1
2
0
0
0

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Summary of Contents for HP X27i

  • Page 1 Marketing Name / Model [List multiple models if applicable.] HP X27i Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
  • Page 2 Quantity of items Item Description Notes included in product Components and waste containing asbestos Components, parts and materials containing refractory ceramic fibers Components, parts and materials containing radioactive substances 2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.
  • Page 3 2. Use tool to release screws on monitor, then use tool to separate rear cover from monitor head through tear down slot.
  • Page 4 3. Disassemble the lamp wire, LVDS FFC*2 and ctrl-BD FFC from connector, separate Assy- chassis from monitor head by hand 4.Disassemble the lamp wire from panel, and disassemble ctrl-BD and LED BD from MF by hand.
  • Page 5 5. Use tool to release screws*9 on MF, then separate the MF from panel. 6. Use tool to release screws*7 on the power board and interface board, then disassemble power-BD and interface-BD from the chassis by hand.
  • Page 6 7. Disassemble the LVDS*4 by hand. 8. Separate foot rubbers by hands or tools.
  • Page 7 9. Release the screws from the base bracket, then disassemble the base plastic cover, swivel ring , and base bracket. 10. Use tool to release screws and separate VESA from column. 11. Use tool to separate vesa cover and vesa bracket.
  • Page 8 12. Use tool to release screws and separate pivot cover. 13. Use tool to release screws and separate tilt cover.
  • Page 9 14. Use tool to separate column front cover and engine cover. 15. Use tool to release screws and separate column rear cover.