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This guide is intended to describe the necessary information needed to operate either the TUSB7320 DEMO EVM REVB or TUSB7340 DEMO EVM REVB boards. In this document you will find how to setup and use the EVM boards. The schematics and bill of materials are also detailed at the end of the document.
The TUSB7340 is a USB 3.0 xHCI 0.96 compliant host controller that supports up to four downstream ports. The TUSB7320 supports up to two downstream ports. The TUSB73x0 interfaces to the host system via a PCIe x1 Gen 2 interface and provides SuperSpeed, High-speed, Full-speed, or Low-speed connections on the downstream USB ports.
EVM Board TUSB7320 and TUSB7340 DEMO Boards The TUSB7320 and TUSB7340 DEMO boards are both PCI Express X1 Standard Height cards. The dimensions of both boards are 4.376 inches by 2.571 inches. The two figures below depict how the boards look.
AUX_DET will be high. If a jumper shunt is placed over J22, the AUX_DET will be low. The J26 header is used to route 5 V from the IDE Power Connector (J5) to the Texas Instruments TPS2560 USB power switch. This header should always have a Jumper Shunt populated. For more information on the Texas Instruments TPS2560, please visit www.ti.com.
SLLU146C – May 2011 – Revised May 2014 SMI Support The SMI pin from the TUSB7320 is brought out to a header labeled SMI. This header is located to the left of J22. The SMI pin from the TUSB7340 is brought out to a via located on the bottom of board near U1. The via is located between C10 and C34 and just above C31.
TUSB7320 DEMO EVM REVB Schematics www.ti.com TUSB7320 DEMO EVM REVB Schematics EPROM VIA AND TRACE REQUIREMENTS: - MIN VIA PAD SIZE 20mils - MIN spacing between trace and pad is 5mils - MIN spacing between VIA and pad is 5mils...
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TUSB7320 DEMO EVM REVB Schematics www.ti.com BOARD_3P3V POPULATE R2 FOR WAKE SUPPORT. JUMPER J22 FOR NO WAKE SUPPORT 0402 HDR2X1 M .1 NOPOP 0402 BOARD_3P3V BOARD_3P3V BOARD_1P1V BOARD_3P3V VDDA3P3V BOARD_3P3V 0.1uF NOPOP NOPOP 0402 0402 NOPOP NOPOP NOPOP NOPOP 0402...
Appendix A Bill of Materials The below table is the bill of materials for the TUSB7320 DEMO EVM REVB board. The rows marked in yellow are components that are not populated on the EVM board. Table 1. TUSB7320 DEMO REVB BOM...
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ADDITIONAL TERMS AND CONDITIONS, WARNINGS, RESTRICTIONS, AND DISCLAIMERS FOR EVALUATION MODULES Texas Instruments Incorporated (TI) markets, sells, and loans all evaluation boards, kits, and/or modules (EVMs) pursuant to, and user expressly acknowledges, represents, and agrees, and takes sole responsibility and risk with respect to, the following: 1.
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RADIO FREQUENCY REGULATORY COMPLIANCE INFORMATION FOR EVALUATION MODULES Texas Instruments Incorporated (TI) evaluation boards, kits, and/or modules (EVMs) and/or accompanying hardware that is marketed, sold, or loaned to users may or may not be subject to radio frequency regulations in specific countries.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue.
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