Thermal Management; Thermal Design Power - Eurotech Vector User Manual

Thermal Management

The following sections provide details about thermal management for the Vector.

Thermal Design Power

When installed in an enclosure, the Vector may require convective cooling or heat spreading to
dissipate the heat generated by the Intel Atom processor and Intel SCH US15W. The following table
summarizes the power dissipation of these components. For additional information, refer to the Intel
Embedded Design Center at http://edc.intel.com/Platforms/Atom-Z5xx/#hthermmech.
Component
(note 1)
Intel Atom processor (1.6 GHz)
Intel SCH US15W
Notes:
1. The values for TDP are taken from the Intel Atom Processor Z5xx Series Datasheet, 319535-003US, June 2010
and Intel System Controller Hub Datasheet, 319537-003US, May 2010.
Thermal Design Power – Max Point
Thermal Design Power – Max Point (TDP) is a representation of the expected peak power dissipation
of each component or component group as viewed separately. The actual power consumption in real-
world applications is not expected to reach this level for any given device and never in combination.
However, the thermal management solution should accommodate proper control of temperature rise
so as not to exceed the maximum thermal surface interface temperatures as identified for key
components such as the Intel Atom processor and Intel SCH US15W.
110124-7000A
Figure 7. Vector, Bottom View
Thermal Design Power
– Max Point
2.2
2.3
Table 8. Thermal Design Power
Hardware Specification
Typical Units
(High End Application)
0.7 W
1.5 W
®
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