NXP Semiconductors FRDM-KW24D512 User Manual

NXP Semiconductors
User's Guide
FRDM-KW24D512 Freedom
Development Platform User's Guide
1

Introduction

This manual describes the development platform,
FRDM-KW24D512. It has a diverse reference design with
all necessary I/O connections to use as a self-contained
platform or for connection to an external application.
The MKW24D512 is a 2.4 GHz Industrial, Scientific, and
Medical (ISM) single-chip device intended for the IEEE
Std. 802.15.4, including Thread, ZigBee
RF4CE standards, and IPv6/6loWPAN protocols.
The FRDM-KW24D512 contains the MKW24D512
transceiver that is typically combined with a software stack
to implement an IEEE Std. 802.15.4 platform solutions.
1.1

Audience

This document is intended for system designers.
2

Safety Information

2.1

FCC guidelines

This equipment is used by developers for evaluation
purposes only and must not be incorporated into any other
®
®
Pro stack, ZigBee
Document Number: FRDMKW24DUG
Contents
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1.Audience . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2. Safety Information . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2.1.FCC guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2.2.Regulatory approval for Canada (IC RSS 210) . . . 2
2.3.Electrostatic discharge considerations . . . . . . . . . . 3
2.4.Disposal instructions . . . . . . . . . . . . . . . . . . . . . . . 3
3. FRDM-KW24D512 Overview and Description . . . . . 3
3.1.Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3.2.Platform features . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.3.Software and driver considerations . . . . . . . . . . . . 6
4. FRDM-KW24D512 Development Platform . . . . . . . 6
4.1.FRDM-KW24D512 platform overview . . . . . . . . 6
4.2.Functional description . . . . . . . . . . . . . . . . . . . . . . 9
4.3.Schematic, platform layout, and bill of material . 17
5. PCB Manufacturing Specifications . . . . . . . . . . . . . 26
5.1.Single PCB construction . . . . . . . . . . . . . . . . . . . 27
5.2.Panelization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5.3.Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5.4.Solder mask . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5.5.Silk screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5.6.Electrical PCB testing . . . . . . . . . . . . . . . . . . . . . 29
5.7.Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.8.Hole specification/tool table . . . . . . . . . . . . . . . . 29
5.9.File description . . . . . . . . . . . . . . . . . . . . . . . . . . 29
6. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Rev. 1, 05/2016