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XM-552ZR
Ver. 1.1
QQ
3 7 63 1515 0
PROTECTOR OPERATION CHECK
Thermal Protect
1. Short across TH901 with the power on.
2. Verify that the protector is operated and LED901 illuminates
green. When input the signal and verify that there is no output
on the SP-OUT even when the volume is increased.
3. Verify that the protector is released and there is an output on the
SP-OUT when the short is removed.
4. Likewise, perform items 1 to 3 for TH902 and TH903.
Over Current Protect
1. Short between the positive and negative sides of the speaker
output terminal CN904 with the power on.
(Perform this shorting for each channel on L and R.)
2. Verify that the protector is operated and LED901 illuminates
red.
3. Verify that the protector is not released and LED901 remains
red even when the short is removed.
4. Verify that the protector is released and LED901 illuminates green
when the power is turned off and then on again.
Offset Protect
1. Short between the +12V terminal of CN903 and the BTL+ or
BTL- of the speaker output terminal CN904.
(Short between +12V terminal and BTL+ and between +12V
terminal and BTL-.)
2. Verify that the protector is operated and LED901 illuminates
red.
3. Verify that the protector is not released and LED901 remains
red even when the short is removed.
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L 13942296513
4. Verify that the protector is released and LED901 illuminates green
when the power is turned off and then on again.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
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Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
.
damaged by heat.
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TABLE OF CONTENTS
Location and Function of Controls .......................................... 3
Connections ............................................................................. 4
2-1. Bottom Plate ........................................................................ 7
2-2. AMP Board Section ............................................................ 8
2-3. Panel (Front) ........................................................................ 8
3-1. Block Diagram .................................................................... 9
3-2. Printed Wiring Board ........................................................ 11
3-3. Schematic Diagram ........................................................... 12
4-1. Heat Sink (Main) Section .................................................. 14
4-2. AMP Board Section .......................................................... 15
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SAFETY-RELATED COMPONENT WARNING!!
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COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
.
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
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