Packaging; Tape And Reel Packaging - Quectel M35 User Manual

The squeegee should push the paste on the surface of the stencil that makes the paste fill the stencil
openings and penetrate to the PCB. The force on the squeegee should be adjusted so as to produce a
clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil at
the hole of the module pads should be 0.2 mm for M35. For more details, please refer to document [5].
It is suggested that peak reflow temperature is from 235º C to 245º C (for SnAg3.0Cu0.5 alloy). Absolute
max reflow temperature is 260º C. To avoid damage to the module when it was repeatedly heated, it is
suggested that the module should be mounted after the first panel has been reflowed. The following
picture is the actual diagram which we have operated.
℃
250
217
200
150
100
50
0
7.3.

Packaging

The modules are stored inside a vacuum-sealed bag which is ESD protected. It should not be opened
until the devices are ready to be soldered onto the application.

7.3.1. Tape and Reel Packaging

The reel is 330mm in diameter and each reel contains 250 modules.
M35_User_Manual
Preheat
Liquids
Temperature
160℃
70s~120s
Between 1~3℃/S
100
50 150
Figure 48: Ramp-Soak-Spike Reflow Profile
Confidential / Released
Heating
200℃
40s~60s
200 250
Time(s)
GSM/GPRS Module Series
M35 User Manual
Cooling
300 s
75 / 85