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Quectel M12 Hardware Design

Quectel M12 Hardware Design

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M12
Quectel Cellular Engine
Hardware Design
M12_Hardware_Design_V3.3

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  • Page 1 Quectel Cellular Engine Hardware Design M12_Hardware_Design_V3.3...
  • Page 2 M12_Hardware_Degsign_V3.3 General Notes Quectel offers this information as a service to its customers, to support application and engineering efforts that use the products designed by Quectel. The information provided is based upon requirements specifically provided for customers of Quectel. Quectel has not undertaken any independent search for additional information, relevant to any information that may be in the customer’s possession.

  • Page 3: Table Of Contents

    M12 Hardware Design Contents Table Index ............................4 Figure Index ............................5 0. Revision history ..........................7 1. Introduction ........................... 8 1.1. Related documents ......................8 1.2. Terms and abbreviations ...................... 9 1.3. Safety cautions ........................11 2. Product concept ........................... 13 2.1.
  • Page 4 M12 Hardware Design 3.10. SIM card interface ......................50 3.10.1. SIM card application ..................... 50 3.10.2. SIM card holder ..................... 52 3.11. ADC ..........................54 3.12. Behaviors of the RI ......................55 3.13. Network status indication ....................57 3.14. Operating status indication ....................58 3.15.
  • Page 5 M12 Hardware Design Table Index TABLE 1: RELATED DOCUMENTS ..................... 8 TABLE 2: TERMS AND ABBREVIATIONS .................. 9 TABLE 3: MODULE KEY FEATURES ..................13 TABLE 4: CODING SCHEMES AND MAXIMUM NET DATA RATES OVER AIR INTERFACE ........................15 TABLE 5: PIN DESCRIPTION ...................... 18 TABLE 6: OVERVIEW OF OPERATING MODES ..............
  • Page 6 M12 Hardware Design Figure Index FIGURE 1: MODULE FUNCTIONAL DIAGRAM ..............16 FIGURE 2: TOP VIEW OF MODULE PIN ASSIGNMENT ............18 FIGURE 3: VOLTAGE RIPPLE DURING TRANSMITTING ............. 25 FIGURE 4: REFERENCE CIRCUIT FOR THE VBAT INPUT ............ 26 FIGURE 5: REFERENCE CIRCUIT FOR POWER SUPPLY ............
  • Page 7 FIGURE 44: REFERENCE CIRCUIT OF RF INTERFACE ............61 FIGURE 45: RECOMMENDATION OF RF PAD WELDING ............. 63 FIGURE 46: M12 TOP AND SIDE DIMENSIONS（UNIT: MM） ..........68 FIGURE 47: M12 BOTTOM DIMENSIONS（UNIT: MM） ............69 FIGURE 48: PAD BOTTOM DIMENSIONS（UNIT: MM） ............69 FIGURE 49: FOOTPRINT OF RECOMMENDATION（UNIT: MM）...

  • Page 8: Revision History

    M12 Hardware Design 0. Revision history Revision Date Author Description of change 2010-07-20 Yong AN Initial 2010-11-30 Yong AN Added Chapter 4.5 for RF pad welding. 2012-02-14 Layne YE 1. Modified the power supply range. 2. Modified buzzer interface as RESERVED.

  • Page 9: Introduction

    M12 Hardware Design 1. Introduction This document defines the M12 module and describes its hardware interface which are connected with the customer application and the air interface. This document can help customer quickly understand module interface specifications, electrical and mechanical details. Associated with application notes and user guide, customer can use M12 module to design and set up mobile applications easily.

  • Page 10: Terms And Abbreviations

    M12 Hardware Design 1.2. Terms and abbreviations Table 2: Terms and abbreviations Abbreviation Description Analog-to-Digital Converter Adaptive Multi-Rate Antenna Reference Point ASIC Application Specific Integrated Circuit Bit Error Rate Bill Of Material Base Transceiver Station CHAP Challenge Handshake Authentication Protocol...
  • Page 11 M12 Hardware Design Abbreviation Description kbps Kilo Bits Per Second Light Emitting Diode Li-Ion Lithium-Ion Mobile Originated Mobile Station (GSM engine) Mobile Terminated Password Authentication Protocol PBCCH Packet Switched Broadcast Control Channel Printed Circuit Board Protocol Data Unit Point-to-Point Protocol...

  • Page 12: Safety Cautions

    Manufacturers of the cellular terminal should send the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. If not so, Quectel does not take on any liability for customer failure to comply with these precautions.
  • Page 13 M12 Hardware Design GSM cellular terminals or mobiles operate over radio frequency signal and cellular network and cannot be guaranteed to connect in all conditions, for example no mobile fee or an invalid SIM card. While you are in this condition and need emergent help, Please Remember using emergency call.

  • Page 14: Product Concept

    M12 is a SMD type module, which can be embedded in customer application through its 64-pin pads. It provides all hardware interfaces between the module and customer’s host board. Designed with power saving technique, the current consumption of M12 is as low as 1.3 mA in SLEEP mode when DRX is 5.
  • Page 15 M12 Hardware Design  Restricted operation: -40° C ~ -35° C and +75° C ~ +80° C  Storage temperature: -45° C ~ +85° C  DATA GPRS GPRS data downlink transfer: max. 85.6 kbps  GPRS data uplink transfer: max. 85.6 kbps ...

  • Page 16: Functional Diagram

    CS-3: 15.6kbps 31.2kbps 62.4kbps CS-4: 21.4kbps 42.8kbps 85.6kbps 2.2. Functional diagram The following figure shows a block diagram of M12 and illustrates the major functional parts.  Power management  Baseband  Serial Flash  The GSM radio frequency part ...

  • Page 17: Evaluation Board

    Figure 1: Module functional diagram 2.3. Evaluation board In order to help customer on the application of M12, Quectel supplies an Evaluation Board (EVB) that hosts the module directly with appropriate power supply, SIM card holder, RS-232 serial interface, handset RJ11 port, earphone port, antenna and other peripherals to control or test the module.

  • Page 18: Application Interface

    SD interface (refer to Section 3.16) Electrical and mechanical characteristics of the SMT pad are specified in Chapter 5&Chapter6. 3.1. Pins of module 3.1.1. Pin assignment The following figure shows pin name and assignment of M12. M12_Hardware_Design_V3.3 - 17 -...

  • Page 19: Pin Description

    M12 Hardware Design Figure 2: Top view of Module pin assignment 3.1.2. Pin description Table 5: Pin description Power supply PIN NAME DESCRIPTION COMMENT CHARACTERISTICS VBAT 50,51 Module main Vmax= 4.6V It must be able to power supply. Vmin=3.3V provide sufficient VBAT=3.3V~4.6V...
  • Page 20 M12 Hardware Design rises to 1.6A. VRTC Power supply for VImax=3.3V Recommended to RTC when VBAT VImin=1.5V connect to a is not supplied. VInorm=2.8V backup battery or a Charging for VOmax=2.85V golden capacitor. backup battery or VOmin=2.6V golden capacitor VOnorm=2.8V...
  • Page 21 M12 Hardware Design Module status indication PIN NAME DESCRIPTION COMMENT CHARACTERISTICS STATUS Used to indicate VOLmax= If unused, keep module’s operating 0.15× VDD_EXT this pin open. status. High level VOHmin= indicates module 0.85× VDD_EXT power-on and low level indicates power-down.
  • Page 22 M12 Hardware Design Main Serial port PIN NAME DESCRIPTION COMMENT CHARACTERISTICS Data terminal VILmin=-0.3V If only use TXD, ready VILmax= RXD and GND to 0.25× VDD_EXT communicate, Receive data VIHmin= recommended Transmit data 0.75× VDD_EXT connecting RTS to Request to send...
  • Page 23 M12 Hardware Design SIM_VDD Voltage supply for The voltage can be All signals of SIM SIM card selected by software interface should be automatically. Either protected against 1.8V or 3V. ESD with a TVS diode array. SIM_DATA SIM data SIM_VDD=3V Maximum trace VILmax=0.4V...

  • Page 24: Operating Modes

    M12 Hardware Design VILmax= 0.12× SIM_VDD VIHmin= 0.9× SIM_VDD VOLmax= 0.12× SIM_VDD VOHmin= 0.9× SIM_VDD SIM_ SIM card detection VILmin=-0.3V If unused, keep PRESENCE VILmax= this pin open. 0.25× VDD_EXT VIHmin= 0.75× VDD_EXT VIHmax= VDD_EXT+0.3 AUX ADC PIN NAME DESCRIPTION...
  • Page 25 M12 Hardware Design Table 6: Overview of operating modes Mode Function Normal GSM/GPRS The module will automatically go into SLEEP mode if DTR operation SLEEP is set to high level and there is no interrupt (such as GPIO interrupt or data on serial port).

  • Page 26: Power Supply

    For the M12 module, the max current consumption could reach to 1.6A during a transmit burst. It will cause a large voltage drop on the VBAT. In order to ensure stable operation of the module, it is recommended that the max voltage drop during the transmit burst does not exceed 400mV.

  • Page 27: Reference Design For Power Supply

    M12 Hardware Design VBAT 100uF 100nF 10pF 33pF 0603 0603 Figure 4 : Reference circuit for the VBAT input 3.3.3. Reference design for power supply The power design for the module is very important, since the performance of power supply for the module largely depends on the power source.

  • Page 28: Monitor Power Supply

    M12 Hardware Design 3.3.4. Monitor power supply To monitor the supply voltage, customer can use the “AT+CBC” command which includes three parameters: charging status, remaining battery capacity and voltage value (in mV). It returns the 0-100 percent of battery capacity and actual value measured between VBAT and GND. The voltage is continuously measured at an interval depending on the operating mode.
  • Page 29 M12 Hardware Design PWRKEY 4.7K Turn on pulse Figure 6: Turn on the module using driving circuit The other way to control the PWRKEY is using a button directly. A TVS component is indispensable to be placed nearby the button for ESD protection. When pressing the key, electrostatic strike may generate from finger.

  • Page 30: Power Down

    M12 Hardware Design VBAT EMERG_OFF (INPUT) >1s > 0.6*VBAT PWRKEY <0.1*VBAT (INPUT) 54ms VDD_EXT (OUTPUT) 800ms STATUS (OUTPUT) MODULE BOOTING RUNNING STATUS Figure 8: Timing of turning on system ① Make sure that VBAT voltage is stable before pulling down PWRKEY pin. The interval time between them is recommended 30ms.
  • Page 31 M12 Hardware Design 3.4.2.1. Power down module using PWRKEY pin In application, the module can be turned off by driving the PWRKEY to a low level voltage for certain time. The power-down scenario is illustrated in Figure 9. The power-down procedure causes the module to log off the network and allows the software to save important data before completely disconnecting the power supply, thus it is a safe way.
  • Page 32 M12 Hardware Design Before the completion of the power-down procedure, the module sends out the result code as shown below: NORMAL POWER DOWN After this moment, no other AT commands can be executed. And then the module enters the POWER DOWN mode, only the RTC is still active. The POWER DOWN mode can also be indicated by STATUS pin, which is a low level voltage in this mode.

  • Page 33: Restart Module Using Pwrkey Pin

    M12 Hardware Design button. The circuit is illustrated as the following figures. EMERG_OFF 4.7K Emergency shutdown pulse Figure 10: Reference circuit for EMERG_OFF by using driving circuit EMERG_OFF Close to S1 Figure 11: Reference circuit for EMERG_OFF by using button Be cautious to use the pin EMERG_OFF.

  • Page 34: Power Saving

    M12 Hardware Design certain time, which is similar to the way to turn on module. Before restarting the module, at least 500ms should be delayed after detecting the low level of STATUS. The restart scenario is illustrated as the following figure.

  • Page 35: Minimum Functionality Mode

    M12 Hardware Design 3.5.1. Minimum functionality mode Minimum functionality mode reduces the functionality of the module to minimum level, thus minimize the current consumption when the slow clocking mode is activated at the same time. This mode is set with the “AT+CFUN” command which provides the choice of the functionality levels <fun>=0，1，4.

  • Page 36: C3.6. Summary Of State Transitions

    M12 Hardware Design  Receive a voice or data call from network to wake up module.  Receive a SMS from network to wake up module. Note: DTR pin should be held low level during communicating between the module and DTE.
  • Page 37 M12 Hardware Design Module 1.5K VRTC RTC Core Rechargeable Backup Battery Figure 15: RTC supply from rechargeable battery Module 1.5K VRTC RTC Core Large Capacitance Capacitor Figure 16: RTC supply from capacitor Coin-type rechargeable capacitor such as XH414H-IV01E from Seiko can be used.

  • Page 38: Serial Interfaces

    M12 Hardware Design Figure 17: Seiko XH414H-IV01E Charge Characteristic 3.8. Serial interfaces The module provides three unbalanced asynchronous serial ports including UART, Debug Port and UART3.The module is designed as a DCE (Data Communication Equipment), following the traditional DCE-DTE (Data Terminal Equipment) connection. Autobauding function supports baud rate from 4800bps to 115200bps.

  • Page 39: Uart Port

    M12 Hardware Design  DBG_TXD: Send data to the COM port of computer  DBG_RXD: Receive data from the COM port of computer The UART3 Port:  TXD3: Send data to the RXD of DTE  RXD3: Receive data from the TXD of DTE The logic levels are described in the following table.
  • Page 40 M12 Hardware Design  Used for AT command, GPRS data, CSD etc. Multiplexing function is supported on the UART Port. So far only the basic mode of multiplexing is available.  Support the communication baud rates as the following: 300,600,1200,2400,4800,9600,14400,19200,28800,38400,57600,115200.
  • Page 41 M12 Hardware Design 3.8.1.2. The connection of UART The connection between module and host via UART port is very flexible. Three connection styles are illustrated as below. UART Port connection is shown as below when it is applied in modulation-demodulation.

  • Page 42: Debug Port

    M12 Hardware Design Host (DTE) Module(DCE) Controller Figure 20: Connection of UART port with hardware flow control 3.8.1.3. Firmware upgrade The TXD and RXD can be used to upgrade firmware. The PWRKEY pin must be pulled down before the firmware upgrade. Please refer to the following figure for firmware upgrade.

  • Page 43: Uart3 Port

    M12 Hardware Design 460800bps. Module (DCE) Computer Debug port DBG_TXD DBG_RXD Figure 22: Connection of debug port 3.8.3. UART3 Port UART3:  Two data lines: TXD3and RXD3  UART3 port is used for AT command only and does not support GPRS data, CSD, Multiplexing function etc.

  • Page 44: Uart Application

    M12 Hardware Design Figure 23: Connection of UART3 port 3.8.4. UART Application The reference design of 3.3V level match is shown as below. When the peripheral MCU/ARM system is 3V, the divider resistor should be changed from 5.6K to 10K.
  • Page 45 M12 Hardware Design 4.7K VDD_EXT VCC_MCU 5.6K Module MCU/ARM 4.7K /TXD /RXD 4.7K 4.7K VDD_EXT VCC_MCU /RTS /CTS GPIO EINT GPIO Voltage level: 5V Figure 25: 5V level match circuit The following picture is an example of connection between module and PC. A RS232 level shifter IC or circuit must be inserted between module and PC, since these three UART ports do not support the RS232 level, while support the CMOS level only.

  • Page 46: Audio Interfaces

    M12 Hardware Design SP3238 T1IN T4OUT T2IN T2OUT T3IN T3OUT T4IN T1OUT T5OUT T5IN MODULE /R1OUT R1OUT R1IN R2OUT R2IN R3OUT R3IN ONLINE /STATUS /SHUTDOWN TO PC serial port Figure 26: RS232 level match circuit 3.9. Audio interfaces The module provides two analogy input channels and two analogy output channels.

  • Page 47: Decrease Tdd Noise And Other Noise

    M12 Hardware Design  AIN1 and AIN2, which may be used for both microphone and line inputs. An electret microphone is usually used. AIN1 and AIN2 are both differential input channels.  AOUT1 and AOUT2, which may be used for both receiver and speaker outputs. AOUT1 channel is typically used for a receiver, while AOUT2 channel is typically used for headset or speaker.

  • Page 48: Receiver And Speaker Interface Configuration

    M12 Hardware Design circuit is shown in Figure 27. Close to Microphone 10pF 33pF Differential layout 0603 0603 Module Electret MICxP Microphone 10pF 33pF 0603 0603 MICxN 10pF 33pF 0603 0603 Figure 27: Microphone reference design for AIN1&AIN2 3.9.3. Receiver and speaker interface configuration...
  • Page 49 M12 Hardware Design Close to speaker 10pF 33pF 0603 Differential layout 0603 Module Amplifier circuit SPK1P 33pF 10pF 0603 0603 SPK1N 10pF 33pF 0603 0603 Figure 29: Reference design with an amplifier for AOUT1 Texas Instruments TPA6205A1 is recommended for a suitable differential audio amplifier. There are plenty of excellent audio amplifiers in the market.

  • Page 50: Earphone Interface Configuration

    M12 Hardware Design Close to speaker 10pF 33pF Differential layout 0603 0603 Module Amplifier circuit SPK2P AGND 10pF 33pF 0603 0603 Figure 31: Reference design with an amplifier for AOUT2 Note: The value of C1 and C2 depends on the input impedance of audio amplifier.

  • Page 51: Sim Card Interface

    M12 Hardware Design Table 12: Typical speaker characteristic Parameter Unit Normal Single Load resistance Output(SPK1) Ended Ref level Differential Load resistance Ref level Auxiliary Single Load resistance Output(SPK2) Ended Ref level Maxim driving current limit of SPK1 and SPK2 3.10. SIM card interface 3.10.1.
  • Page 52 M12 Hardware Design default configuration, SIM card detection function is disabled. Customer’s application can use “AT+QSIMDET=1,0” to switch on and “AT+QSIMDET=0,0” to switch off the SIM card detection function. For details of this AT command, please refer to document [1]. When “AT+QSIMDET=1,0”...

  • Page 53: Sim Card Holder

    M12 Hardware Design 33pF 100nF SIM_Holder SIM_VDD SIM_RST Module SIM_CLK SIM_PRESENCE SIM_DATA 33pF 33pF 33pF ESDA6V8V6 Figure 34: Reference circuit of the 6 pins SIM card In SIM interface designing, in order to ensure good communication performance with SIM card, the following design principles should be complied with.
  • Page 54 M12 Hardware Design Figure 35: Amphenol C707 10M006 512 2 SIM card holder Table 14: Pin description of Amphenol SIM card holder Name Function SIM_VDD SIM Card Power supply SIM_RST SIM Card Reset SIM_CLK SIM Card Clock Ground Not Connect...

  • Page 55: Adc

    M12 Hardware Design Figure 36: Molex 91288 SIM card holder Table 15: Pin description of Molex SIM card holder Name Function SIM_VDD SIM Card Power supply SIM_RST SIM Card Reset SIM_CLK SIM Card Clock SIM_PRESENCE SIM Card Presence Detection Ground...

  • Page 56: Behaviors Of The Ri

    M12 Hardware Design Table 16: Pin definition of the ADC Name Function ADC0 Analog to digital converter. ADC1 Analog to digital converter Table 17: Characteristics of the ADC Item Units Voltage Range ADC Resolution bits ADC Accuracy 3.12. Behaviors of the RI...
  • Page 57 M12 Hardware Design HIGH Off-hook by“ATA” On-hook by “ATH” SMS received Idle Ring Figure 37: RI behaviour of voice calling as a receiver HIGH Data calling establish On-hook by “ATH” SMS received Idle Ring Figure 38: RI behaviour of data calling as a receiver...

  • Page 58: Network Status Indication

    M12 Hardware Design 120ms HIGH URC or Idle or talking SMS received Figure 40: RI behaviour of URC or SMS received 3.13. Network status indication The NETLIGHT signal can be used to drive a network status indicator LED. The working state of this pin is listed in Table 19.

  • Page 59: Operating Status Indication

    M12 Hardware Design 3.14. Operating status indication The STATUS pin is set as an output pin and can be used to judge whether module is power-on, please refer to Section 3.4. In customer design, this pin can be connected to a GPIO of DTE or be used to drive an LED in order to judge the module’s operation status.

  • Page 60: Sd Card Interface

    M12 Hardware Design 3.16. SD card interface The module provides SD card interface that supports many types of memory, such as Memory Stick, SD/MCC card and T-Flash or Micro SD card. The following are the main features of SD card interface: ...
  • Page 61 M12 Hardware Design Table 23: Pin name of the SD card and T-Flash(Micro SD) card Pin No. Pin name of SD card Pin name of T-Flash(Micro SD) card CD/DATA3 DATA2 CD/DATA3 VSS1 VSS2 DATA0 DATA0 DATA1 DATA1 DATA2 In SD card interface designing, in order to ensure good communication performance with SD card, please follow the design principles below: ...

  • Page 62: Antenna Interface

    Figure 44: Reference circuit of RF interface 4.1. Antenna installation M12 provides an RF antenna PAD for customer’s antenna connection. The RF trace in host PCB connected to the module’s RF antenna pad should be coplanar waveguide line or microstrip line, which characteristic impedance should be close to 50Ω.

  • Page 63: Rf Output Power

    M12 Hardware Design 4.2. RF output power Table 25: The module conducted RF output power Frequency EGSM900 33dBm ± 2dB 5dBm± 5dB DCS1800 30dBm ± 2dB 0dBm± 5dB Note: In GPRS 4 slots TX mode, the max output power is reduced by 2.5dB. This design conforms to the GSM specification as described in section 13.16 of 3GPP TS 51.010-1.
  • Page 64 M12 Hardware Design Figure 45: Recommendation of RF pad welding M12_Hardware_Design_V3.3 - 63 -...

  • Page 65: Electrical, Reliability And Radio Characteristics

    M12 Hardware Design 5. Electrical, reliability and radio characteristics 5.1. Absolute maximum ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of module are listed in the following table: Table 28: Absolute maximum ratings Parameter...

  • Page 66: Power Supply Ratings

    M12 Hardware Design 5.3. Power supply ratings Table 30: The module power supply ratings Parameter Description Conditions Min Typ Unit VBAT Supply Voltage must stay within the voltage min/max values, including voltage drop, ripple, and spikes. Voltage drop Maximum power control level during on GSM850 and GSM900.

  • Page 67: Current Consumption

    M12 Hardware Design Parameter Description Conditions Min Typ Unit DCS1800 Peak supply Maximum power control level current on GSM900. (during transmission slot) Power control level PCL 5 Power control level PCL 0 5.4. Current consumption The values for current consumption are shown in Table 31.

  • Page 68: Electro-Static Discharge

    M12 Hardware Design @power level #19,Typical 111mA DCS 1800 @power level #0 <490mA,Typical 464mA @power level #7,Typical 172mA @power level #15,Typical 102mA DATA mode, GPRS ( 4 Rx,1 Tx ) CLASS 12 EGSM 900 @power level #5 <350mA,Typical 230mA @power level #12,Typical 118mA...

  • Page 69: Mechanical Dimensions

    M12 Hardware Design 6. Mechanical dimensions This chapter describes the mechanical dimensions of the module. 6.1. Mechanical dimensions of the module Figure 46: M12 top and side dimensions（Unit: mm） M12_Hardware_Design_V3.2 - 68 -...
  • Page 70 M12 Hardware Design test point Figure 47: M12 bottom dimensions（Unit: mm） Figure 48: Pad bottom dimensions（Unit: mm） M12_Hardware_Design_V3.2 - 69 -...

  • Page 71: Footprint Of Recommendation

    M12 Hardware Design 6.2. Footprint of recommendation single pad M12_Hardware_Design_V3.2 - 70 -...
  • Page 72 M12 Hardware Design module dimension safe area line keepout area Figure 49: Footprint of recommendation（Unit: mm） ： Note1 Keep out the area below the test point in the host PCB. Place solder mask. ： Note2 In order to maintain the module, keep about 3mm between the module and other components in host PCB.

  • Page 73: Top View Of The Module

    M12 Hardware Design 6.3. Top view of the module Figure 50: Top view of the module 6.4. Bottom view of the module Figure 51: Bottom view of the module M12_Hardware_Design_V3.2 - 72 -...

  • Page 74: Appendix A: Gprs Coding Schemes

    M12 Hardware Design Appendix A: GPRS coding schemes Four coding schemes are used in GPRS protocol. The differences between them are shown in Table 33. Table 33: Description of different coding schemes Scheme Code USF Pre-coded Radio Tail Coded Punctured...

  • Page 75: Appendix B: Gprs Multi-Slot Classes

    The active slots determine the total number of slots the GPRS device can use simultaneously for both uplink and downlink communications. The description of different multi-slot classes of the M12 module support is shown in Table 34. Table 34: GPRS multi-slot classes...
  • Page 76 M12 Hardware Design Shanghai Quectel Wireless Solutions Co., Ltd. Room 501, Building 13, No.99, Tianzhou Road, Shanghai, China, 200233 Tel: +86 21 5108 6236 Mail: info@quectel.com M12_Hardware_Design_V3.2 - 75 -...

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