<Photo board>
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
1
T1C
3
G
4P1C
No.MA473
created date:2010-06-18
(No.MA473<Rev.002>)31/31