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<Main board>
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
J1001
J101
L1
R21
C1502
R19
R23
X1
CN111
C32
BZ951
T1D
TP707
(S2UDT)
P1D
(U2SDT)
No.MA473
J1002
C1264
C1329
C1364
C1164
C1328
C1501
C962
C961
C715
C714
TP709
(SCLK)
TP706
(UCS)
TP708
TP710
(SCS)
(No.MA473<Rev.002>)13/31
IC801
C803
CN101
C1402
R1403
C1113
C1371
C1372
C1103
C1203
C1213
C822
C1942
C723
R7034
TP31
C703
C713
R765
TP766
TP776
(AREA)
TP765
TP774
(AREA.G)
R7094
TP787
(KEY.DATA)
TP748
(DISP.CE)
D755
(DISP.DATA)
D756
J1381
C1381
C801
PP3
C921
D901
R901
CN112
C902
C1114
C1104
L901
C1204
C1214
C8110
C8007
TP750
(DISP.CLK)
TP728
C882
TP71
TP749
TP72
CN901
C1111
C1211
C1304
C1305
C901
C1311
C1312
PP1
PP2
created date:2010-06-18
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