<Key board>
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
P1D
T1D
No.MA473
created date:2010-06-18
(No.MA473<Rev.002>)21/31