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(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
No.MA473
IC601
RX
TP606
C6212
Q6202
R6214
R6218
D6202
Q6204
CN604
(No.MA473<Rev.002>)16/31
PbF
UL
MARK
R6122
C6124
CN601
TP603
TP607
RESET
VDD
TP601
D6106
FLMD0
R6120
TX
TP614
TP605
D6107
TP608
GND
TP611
TP613
FLGND
TP612
D6105
C6121
Q6102
C6120
R6101
R6102
Q6101
R6107
C6102
L6101
C6115
L6102
C6114
R6201
R6240
R6202
CN605
R6206
R6241
R6242
R6209
R6215
R6217
R6216
C6117
IC613
<Panel-B board>
C6122
LVA10922-
A1
F1D
S1D
C6118
C6116
C6211
created date:2010-06-18
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