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(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
TL309
C3311
TL310
TL315
R3586
TL323
C3303
TL318
R3589
C303
C3485
C3484
C3492
C3491
R3494
TL319
R3493
C3473
TL320
TP301
TP302
TP303
TP304
TP305
R3414
R3415
R3421
R3422
R3423
TL321
RA304
RA301
RA302
C301
SEPARATE by VicRobo-L
S1D
1P1D
No.MA473
UL
MARK
TL306
CN311
TL308
TL307
R3477
R321
R325
R322
D3468
TP306
R3469
R3577
TL317
C3465
TL316
C3575
X402
C3469
C3475
R3454
R3447
R3446
R3445
R3443
R3444
K3440
IC301
C3409
C3426
C3407
C3424
RA303
LVA10924
-A1
<BT AMP board>
USE BLOCK
TL311
C304
IC302
R324
TL304
TL303
C3454
TL305
CN301
C339
TL301
PbF
F
S
(No.MA473<Rev.002>)26/31
created date:2010-06-18
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