Table of Contents
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(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
C5203
R5209
R5206
R5208
D4003
R5218
IC511
R4309
C5304
X4002
R4310
R4407
R4314
C4401
Q4401
R4402 L4402
C4308
R4312
C4309
C4402
R4403
R4311
R4404
R4405
R5307
IC402
C5303
C4403
C4404
R5308
C4307
R5304
R5309
C5302
C5528
R5311
R5516
TH531
C5301
R5312
R5517
R5104
R5301
Q4003
C5515
R5518
R5306
R5501
C5520
C5519
C5518
C5534
CN401
R5523 R5522
R5521
S1D
1P1D
No.MA473
Q5204
R5215
R5216
C4145
R4136
C4134
R5106
C4157
Q5105
C4163
R4168
D4004
X4001
C4180
R5513
R5514
RA414
R5515
IC401
RA403
RA404
R4017 RA405 RA406
C5503
C5501
C4301
IC403
C4302
R4307
<Panel-A board>
R4114
R4118
C4132
C4109
C4121
C4537
R4547
IC451
C4048
C4035
C4037
RA411
RA409
RA410
IC461
(No.MA473<Rev.002>)14/31
created date:2010-06-18
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