JVC KW-AVX810J Schematic Diagrams
Dvd receiver with monitor
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Also See for KW-AVX810J:
- Installation & connection manual (6 pages) ,
- Service manual (42 pages)
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SCHEMATIC DIAGRAMS
DVD RECEIVER WITH MONITOR
KW-AVX810J,KW-AVX810E,KW-AVX810EU
KW-AVX810EE,KW-AVX810U,KW-AVX810UN
KW-AVX810UT,KW-AVX810A,KW-AVX814UI
Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade)
Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade)
Contents
DVD-ROM No.SML2008Q1
KW-AVX810J
Block diagram
Standard schematic diagrams
Printed circuit boards
COPYRIGHT
2008 Victor Company of Japan, Limited.
KW-AVX810EE
2-1
2-2
2-7 to 10
KW-AVX810E
No.MA403SCH<Rev.001>
2008/4
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Related Manuals for JVC KW-AVX810J
Summary of Contents for JVC KW-AVX810J
- Page 1 SCHEMATIC DIAGRAMS DVD RECEIVER WITH MONITOR KW-AVX810J,KW-AVX810E,KW-AVX810EU KW-AVX810EE,KW-AVX810U,KW-AVX810UN KW-AVX810UT,KW-AVX810A,KW-AVX814UI DVD-ROM No.SML2008Q1 KW-AVX810EE KW-AVX810E KW-AVX810J Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade) Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade)
- Page 2 Safety precaution Burrs formed during molding may be left over on some parts of the chassis. Therefore, pay attention to such burrs in the case of preforming repair of this system. Please use enough caution not to see the beam directly or touch it in case of an adjustment or operation check.
- Page 3 CFL14.4V IC501,IC502 SLOT_LED 32.768kHz 48MHz BUS_SI, BUS_SO FLASH ROM SD_HLOCK IC951,IC952 BUS_IO, BUS_SCK- SI/SO D8003,D8004,Q8012 SLOT_LED KEY_DATA CD CHANGER X351 JVC BUS /FL_RST SLOT LED DISP_CE ACC5V D6,D7 CONTROL CHL/R 27MHz CPURST DISP_CLK EPWP IR LED DISP_DATA D8007,Q8001,Q8002 SD_HLOCK I2CSCL D3.3V...
- Page 4 C9251 PNL_SW Q9551 NQL79GM-220X -12.2V -15.0V MA22D23-X UN2211-X R9301 PANEL-12V DGND 4 13.8V R9253 R9251 MOTOR+ 5 R9510 -12.8V MOTOR- JVC BUS R9254 X7301 X7302 D9601 IC952 4.7k MA22D23-X BUS_SCK TC7WT241FU-X R9601 2.2k 7.8V C9602 0.047 D9254 7.8V MA111-X C9601 U3.3V...
- Page 5 Sub section LVA10799-A1 DATA1 GPS ANT GPS Module DATA1 NX7000 DATA0 DATA0 IC656 CN654 DGND D_GND L6201 K6201 S3.3V S3.3V S3.3V SD SLOT NQL79GM-220X DATA3 DATA3 24 23 22 21 20 19 18 17 CN603 DATA2 DATA2 R6210 NNZ0202-001X D6202 MA111-X DGND USB_D+...
- Page 6 Panel 1 section C4601 L4602 NQR0450-001X NQL52EM-100X IC463 TP518 C423 NI TPCP8402JVC-X T4601 CFL CTL&DRIVER C422 0 NQR0636-001 D4601 C4626 C4628 10/25 7.0V 5.2V 5.1V MA111- X IC461 2.5V 7.0V 2.2/16 C4604 OZ964ISN-X 14.1V 7.0V 12.4V 7.0V 4.5V Q4605 C4605 R4603 C421 NI 2.2/10...
- Page 7 Panel 2 / Front section DOOR MOTOR QAR0378-001 CN852 QGA1002C1-02X Q8501 R8508 R8509 2SD601A/QR/-X 2.2k IC851 R8504 1.1V CPI-210/BC/-X 0.1V 0.2V PHOTO SENSOR LVA10800-A3 CN851 QGA1002C1-06X LVA10800-A2 LVA10800-A1 CN801 QGB1004J2-12X NAVI-B NAVI_B B_GND NAVI-G NAVI-G G_GND NAVI-R NAVI-R RGB_GND VSYNC VSYNC PANEL5V HSYNC...
- Page 8 Front end section 3.3_REG P3.3V R110 P3.3V D3.3V NAX0927-001X MM3233DF-X K103 R302 R301 X354 0.39 0.0V NQR0502-001X 0.0V K104 S3.3V 4.2V 4.2V L302 P3.3V 3.3V 0.0V C135 NQR0502-001X VOUT 0.1/16 SDRAM 0.0V FLASH ROM 0.0V CD/DVD K113 IC399 P3.3V S3.3V NQR0502-001X IC398 M12L128168A-7TG...
- Page 9 Printed circuit boards Main board Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade) forward side reverse side Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade) CN902 IC911 CN902 BK911...
- Page 10 Sub board Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade) forward side reverse side Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade) C6001 D6201 C6213 R6201 PP601 R6202 CN607...
- Page 11 Front board Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade) Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade) forward side R8002 R8005 Q8001 R8004 R8001 Q8012 R8018 TP806 C8013...
- Page 12 Front end board Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade) Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade) forward side K102 Q101 Q103 R183 R37 R36 Q104 R181 R176...
- Page 13 < M E M O >...
- Page 14 Victor Company of Japan, Limited Mobile Entertainment Business Group Mobile Entertainment Category 10-1,1chome,Ohwatari-machi,Maebashi-city,Gumma-ken,371-8543,Japan Printed in Japan (No.MA403SCH<Rev.001>)