1.2 Special Features ................................................................................................................18
Onboard Voltage Monitors ................................................................................................19
System Resource Alert......................................................................................................19
1.4 ACPI Features ....................................................................................................................19
1.5 Power Supply .....................................................................................................................20
1.6 Super I/O ............................................................................................................................20
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Management Engine (ME) ................................................................................................21
Precautions .......................................................................................................................22
Unpacking .........................................................................................................................22
Tools Needed ....................................................................................................................23
Package Assembly ............................................................................................................29
Attaching the Non-F Model Processor Package Assembly to the Heatsink to Form the
Table of Contents
5
Preface