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Siemens SIMATIC S7-300 Manual

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SIMATIC S7-300 S7-300 CPU Data: CPU 315T-2 DP
SIMATIC
S7-300
S7-300 CPU Data: CPU 315T-2 DP
Manual
12/2005
A5E00427933-02
______________
Preface
______________
Product Overview
Operator controls and
______________
indicators
Setting up an S7-300 with a
______________
Technology CPU
Communication with the
______________
S7-300
______________
Memory concept
______________
Cycle and response times
______________
Technical data
Information for the
______________
Changeover to the
Technology CPU
______________
Appendix A
1
2
3
4
5
6
7
8
9
A

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  • Page 1 ______________ Preface SIMATIC S7-300 S7-300 CPU Data: CPU 315T-2 DP ______________ Product Overview Operator controls and ______________ indicators SIMATIC Setting up an S7-300 with a ______________ Technology CPU S7-300 S7-300 CPU Data: CPU 315T-2 DP Communication with the ______________ S7-300...

  • Page 2: A5E00427933

    Trademarks All names identified by ® are registered trademarks of the Siemens AG. The remaining trademarks in this publication may be trademarks whose use by third parties for their own purposes could violate the rights of the owner.

  • Page 3: Table Of Contents

    Table of contents Preface ..............................1-1 Product Overview ........................... 2-1 Operator controls and indicators......................3-1 Setting up an S7-300 with a Technology CPU ..................4-1 Overview ............................ 4-1 S7-300 components........................4-1 Configuring..........................4-2 Subnets ............................4-2 4.4.1 Expanding and Networking Subnets..................4-2 4.4.2 Interfaces ...........................
  • Page 4 Table of contents 6.1.4 Address areas of system memory ..................... 6-4 6.1.5 Properties of the Micro Memory Card (MMC) ................6-7 6.1.6 Saving/retrieving whole projects to/from the Micro Memory Card ..........6-8 Memory functions........................6-10 6.2.1 Downloading the user program....................6-10 6.2.2 Downloading a user program (enhanced handling)..............
  • Page 5 Table of contents Runtimes that change while the program is running ..............9-4 Converting the diagnostic addresses of DP slaves ..............9-4 Reusing existing hardware configurations ................. 9-5 Replacement of a Technology CPU ..................9-5 Using consistent data areas in the process image for DP slaves..........9-5 Load memory design for the Technology CPU................
  • Page 6 Table of contents Table 5-6 Availability of the S7 connections for the CPU 315T-2 DP ............5-16 Table 6-1 Retentive behavior of the memory objects................. 6-3 Table 6-2 Retentive behavior of the DBs for the Technology CPU............6-4 Table 6-3 Address areas of system memory .....................

  • Page 7: Preface

    Preface Purpose of this manual This manual contains all the necessary information for the installation, the communication functions, the memory concept, the cycle and response times as well as the technical specifications of the Technology CPU. You will then learn the points to consider when upgrading to the CPU discussed in this manual.

  • Page 8: Table 1-2 Documentation For The Technology Cpu

    EC directives: • EC Directive 73/23/EEC "Low-voltage directive" • EC Directive 89/336/EEC "EMC Directive" C-tick mark The SIMATIC S7-300 product series is compliant with AS/NZS 2064 (Australia and New Zealand). Standards The SIMATIC S7-300 product series is compliant with IEC 61131-2.

  • Page 9: Table 1-3 Additional Documentation For The Technology Cpu

    Siemens representative or office nearest you. http://www.siemens.com/automation/partner Training center SIEMENS offers a range of courses to help you to get started with your S7-300 automation system. Please contact your regional Training Center, or the central Training Center in D- 90327 Nuremberg.
  • Page 10 • Telephone: + 49 180 5050 222 • Fax: + 49 180 5050 223 Further information about SIEMENS technical support is available on the Internet at http://www.siemens.com/automation/service Service & Support on the Internet In addition to our documentation, we offer a comprehensive knowledge base online on the Internet at: http://www.siemens.com/automation/service&support...

  • Page 11: Product Overview

    The Technology CPU is especially suited to solving the following control tasks: • Control tasks and technology requirements primarily relating to motion control in the SIMATIC S7-300 • Motion tasks for up to eight coupled axes or single axes • Technological tasks, e.g. gearing and camming, position-controlled positioning (operating modes: absolute, relative, additive and superimposed), travel to fixed stop, probe-based print mark correction, position- or time-dependent cam control).
  • Page 12 S7 controllers and distributed I/O. Extensive networks can be built up in DP interface mode. DP(DRIVE) interface The DP(DRIVE) interface is optimized for the connection of drives. It supports all the major SIEMENS drive types: • MICROMASTER 420/430/440 and COMBIMASTER 411 • SIMODRIVE 611 universal •...
  • Page 13 Product Overview • Isochronous PROFIBUS encoder "SIMODRIVE sensor isochronous" The components configured in HW Config are displayed in the "Hardware Catalog" window in HW Config. To show the screen, select profile "SIMATIC Technology CPU" in HW Config. To ensure that the profile's selection list is complete, you must have installed the most recent version of S7-Technology.
  • Page 14 Product Overview S7-300 CPU Data: CPU 315T-2 DP Manual, 12/2005, A5E00427933-02...

  • Page 15: Operator Controls And Indicators

    Operator controls and indicators Operator controls and indicators of the CPU The following diagram shows the operator controls and indicators on the Technology CPU. Figure 3-1 Operator controls and indicators of the Technology CPU Table 3-1 Operator controls and indicators of the Technology CPU The number in the points to the following element on the Technology CPU diagram...

  • Page 16: Table 3-2 Integrated Technology Inputs And Outputs On The Technology Cpu

    Operator controls and indicators The digital outputs are provided for high-speed camming functions. They can be programmed with technology functions in the STEP 7 user program. Digital inputs can be used with technology functions such as reference point acquisition (reference cam) as well as with technology functions in the STEP 7 user program.
  • Page 17 Operator controls and indicators Mode selector switch The mode selector switch is used to set the current CPU operating mode. Table 3-3 Switch positions of the mode selector switch Position Meaning Description RUN mode The CPU executes the user program. STOP STOP mode The CPU does not execute a user program.
  • Page 18 Operator controls and indicators Shutdown What happens during shutdown? 1. The control of the Technology CPU is already in STOP mode during "shutdown". The outputs of the centralized and distributed I/Os on the MPI/DP are deactivated. The "STOP" LED flashes at 2 Hz. The "RUN" LED lights up. 2.

  • Page 19: Setting Up An S7-300 With A Technology Cpu

    Setting up an S7-300 with a Technology CPU Overview This section S7-300 contains the information which differs from the content of installation manual Programmable Controller, Assembly: CPU 31xc and CPU 31x or useful supplementary information. S7-300 components Which components do you need to build an S7-300 with Technology CPU? The following diagram shows one possible configuration: Figure 4-1 S7-300 components...

  • Page 20: Configuring

    Setting up an S7-300 with a Technology CPU 4.3 Configuring Table 4-1 S7-300 components The number in the points for the following component of an S7-300 system diagram Power supply (PS) module Central processor unit (CPU) Signal module (SM) PROFIBUS cable Cable for connecting a programming device (PG) or for networking with other SIMATIC controls You use a programming device (PG) to program the S7300.

  • Page 21: Table 4-2 Subnet Nodes

    Setting up an S7-300 with a Technology CPU 4.4 Subnets Transmission rate Maximum transmission rates: • MPI/PROFIBUS DP: 12 Mbaud We recommend that you set 12 Mbaud for the Technology CPU • DP(DRIVE): 12 Mbaud Note Before you transfer projects to the Technology CPU via the MPI/DP interface, you should increase the baud rate to at least 1.5 Mbaud or else the data transmission can take a very long time (up to 15 minutes at 187.5 kbaud).

  • Page 22: Interfaces

    Setting up an S7-300 with a Technology CPU 4.4 Subnets 4.4.2 Interfaces MPI/DP interface You can reconfigure this interface in STEP 7 as a PROFIBUS DP interface. The MPI (Multi-Point Interface) represents the CPU interface for PG/OP connections, or for communication on an MPI subnet.

  • Page 23: Addressing

    Setting up an S7-300 with a Technology CPU 4.5 Addressing Addressing Slots of the S7-300 and associated module start addresses The Technology CPU is assigned to two slot numbers: 2 and 3. The input and output addresses for I/O modules begin at the same module start address. Figure 4-2 Slots of the S7-300 with Technology CPU and associated module start addresses Integrated inputs and outputs for integrated technology...

  • Page 24: 4.6 Commissioning

    Updating the operating system You can order the latest operating system versions from your Siemens contact or download it from the Internet at (Siemens Homepage; Industrial Automation, Customer Support). Status and error displays of the Technology CPU...
  • Page 25 The maximum duration of shutdown depends on your configuration in S7TConfig. Flashes Flashes HOLD/shutdown (0.5 Hz) (2 Hz) Flashes Flashes Flashes Flashes Flashes Internal errors in Technology CPU. Contact your local SIEMENS partner. S7-300 CPU Data: CPU 315T-2 DP Manual, 12/2005, A5E00427933-02...

  • Page 26: Table 4-6 Leds Bf1 And Bf3

    Setting up an S7-300 with a Technology CPU 4.8 Status and error displays of the Technology CPU Status and error displays for DP or DP(DRIVE) Table 4-6 LEDs BF1 and BF3 Meaning On/ flashes Error on the PROFIBUS DP interface of the Technology CPU. Remedy: See table LED BF1 illuminated On/ flashes Error on the DP(DRIVE) interface...

  • Page 27: Table 4-9 Led Bf3 Illuminated

    Setting up an S7-300 with a Technology CPU 4.8 Status and error displays of the Technology CPU Table 4-9 LED BF3 illuminated Possible Errors CPU reaction Possible Remedies Bus fault (physical fault) • Error message in the technology DB Check for short-circuit or interruption in configured by you.
  • Page 28 Setting up an S7-300 with a Technology CPU 4.8 Status and error displays of the Technology CPU S7-300 CPU Data: CPU 315T-2 DP 4-10 Manual, 12/2005, A5E00427933-02...

  • Page 29: Communication With The S7-300

    Communication with the S7-300 Interfaces 5.1.1 Overview Overview The Technology CPU has two interfaces: • MPI/DP interface (X1) • PROFIBUS DP(DRIVE) interface (X3) Figure 5-1 Technology CPU interfaces S7-300 CPU Data: CPU 315T-2 DP Manual, 12/2005, A5E00427933-02...
  • Page 30 Communication with the S7-300 5.1 Interfaces 5.1.2 MPI/DP interface (X1) Availability The Technology CPU features an MPI/DP interface (X1). A CPU with MPI/DP interface is supplied with default MPI parameter settings. Depending on your requirements, you may need to reconfigure the interface as a DP interface in STEP 7. MPI properties The MPI (Multi-Point Interface) represents the CPU interface for PG/OP connections, or for communication on an MPI subnet.

  • Page 31: Profibus Dp(Drive) Interface (X3)

    Communication with the S7-300 5.1 Interfaces Devices capable of MPI communication • PG/PC • OP/TD • S7-300 / S7-400 with MPI interface • S7-200 (with 19.2 kbaud only) Properties of PROFIBUS DP The PROFIBUS DP interface is mainly used to connect distributed I/O. PROFIBUS DP allows you to create extensive subnets, for example.

  • Page 32: Dpv1 (X1 Only As Profibus Dp Interface)

    Communication with the S7-300 5.2 DPV1 (X1 only as PROFIBUS DP interface) Note If you deselect "Startup with different target / actual configurations" in the Technology CPU properties in STEP 7, then the Technology CPU will boot even if the stations configured on DP-DRIVE are missing.

  • Page 33: Table 5-1 Interrupt Blocks With Dpv1 Functionality

    Communication with the S7-300 5.2 DPV1 (X1 only as PROFIBUS DP interface) Definition DPV1 The term DPV1 is defined as a functional extension of the acyclical services (to include new interrupts, for example) provided by the DP protocol. Enhancement of the distributed I/O EN 50170 standard.
  • Page 34 Communication with the S7-300 5.2 DPV1 (X1 only as PROFIBUS DP interface) Note You can now also use organizational blocks OB40 and OB82 for DPV1 interrupts. System blocks with DPV1 functionality Table 5-2 System function blocks with DPV1 functionality Functionality SFB 52 Read data record from DP slave or centralized module SFB 53...

  • Page 35: Communication Services On The Mpi/Dp Interface (X1)

    Communication with the S7-300 5.3 Communication services on the MPI/DP interface (X1) Communication services on the MPI/DP interface (X1) 5.3.1 Overview of communication services Selecting the communication service You need to decide on a communication service, based on functionality requirements. Your choice of communication service will influence •...

  • Page 36: Pg Communication

    Communication with the S7-300 5.3 Communication services on the MPI/DP interface (X1) 5.3.2 PG communication Properties PG communication is used to exchange data between engineering stations (PG, PC, for example) and SIMATIC modules which are capable of communication. This service is available for MPI, PROFIBUS and Industrial Ethernet subnets.

  • Page 37: S7 Basic Communication

    Communication with the S7-300 5.3 Communication services on the MPI/DP interface (X1) 5.3.4 S7 basic communication Properties S7 basic communication is used to exchange data between S7 CPUs and the communication-capable SIMATIC modules within an S7 station (acknowledged data exchange). Data are exchanged across non-configured S7 connections. The service is available via MPI subnet, or within the station to function modules (FM).

  • Page 38: Global Data Communication

    Communication with the S7-300 5.3 Communication services on the MPI/DP interface (X1) 5.3.6 Global data communication Global data communication Global data communication is used for cyclic exchange of global data (for example, I, Q, M) between SIMATIC S7 CPUs (data exchange without acknowledgement). One CPU broadcasts its data to all other CPUs on the MPI subnet.

  • Page 39: Routing

    Communication with the S7-300 5.3 Communication services on the MPI/DP interface (X1) Reference Further information Instruction list STEP 7 • about SFCs can be found in the , for more details refer to the online help System and Standard Functions and to the reference manual.
  • Page 40 Communication with the S7-300 5.3 Communication services on the MPI/DP interface (X1) Requirements for routing • The station modules are "capable of routing" (CPUs or CPs). • The network configuration does not exceed project limits. • The modules have loaded the configuration data containing the latest "knowledge" of the entire network configuration of the project.

  • Page 41: Data Consistency

    Communication with SIMATIC • fundamentals can be found in the Manual. • about TeleService adapters can be found at Internet website http://www.ad.siemens.de/support with article ID 14053309 (documentation). Instruction list STEP 7 online • on SFCs can be found in the...

  • Page 42: S7 Communication Structure

    Communication with the S7-300 5.4 S7 communication structure S7 communication structure 5.4.1 Communication path of an S7 connection An S7 connection is established when S7 modules communicate with one another. This connection is the communication path. Note Global data communication and point-to-point links do not require S7 connections. Every communication link requires S7 connection resources on the CPU for the entire duration of this connection.

  • Page 43: Assignment Of S7 Connections

    Communication with the S7-300 5.4 S7 communication structure 5.4.2 Assignment of S7 connections There are several ways to allocate S7 connections on a communication-capable module: • Reservation during configuration • Assigning connections in the program • Allocating connections during commissioning, testing and diagnostics routines •...

  • Page 44: Distribution And Availability Of S7 Connection Resources

    Communication with the S7-300 5.4 S7 communication structure Time sequence for allocation of S7 connection resources STEP 7 When you program your project in , the system generates parameter assignment blocks which are read by the modules in the startup phase. This allows the module's operating system to reserve or allocate the relevant S7 connection resources.

  • Page 45: Table 5-6 Availability Of The S7 Connections For The Cpu 315T-2 Dp

    Communication with the S7-300 5.4 S7 communication structure Communication service Distribution Routing PG functions The CPU provides a certain number of connection resources for routing. These connections are available in addition to the S7 connection resources. The number of routing connections can be found in the Technical Specifications.
  • Page 46 Communication with the S7-300 5.4 S7 communication structure S7-300 CPU Data: CPU 315T-2 DP 5-18 Manual, 12/2005, A5E00427933-02...

  • Page 47: Memory Concept

    Memory concept Memory areas and retentive address areas 6.1.1 Technology CPU memory areas Introduction The memory of the Technology CPU is divided into three areas: Figure 6-1 Technology CPU memory areas Load memory The load memory is located on a micro memory card (MMC). It is used to store code blocks, data blocks and system data (configuration, connections, module parameters, technology system data etc.).

  • Page 48: Retentive Address Areas Of The Load Memory, System Memory And Technology System Data

    Memory concept 6.1 Memory areas and retentive address areas Caution User programs can only be downloaded and thus the CPU can only be used if the MMC is inserted. If you pull out the MMC while the CPU is in RUN mode, the CPU then goes into STOP mode STEP 7 and the drives are shut down in accordance with your programming in the user...

  • Page 49: Retentive Behavior Of The Memory Objects

    Memory concept 6.1 Memory areas and retentive address areas The diagnostics buffer, MPI address (and transmission rate) and operating hour counter data are generally written to the retentive memory area on the CPU. The retentive address areas of the MPI address and transmission rate ensures that your CPU can continue to communicate, even after a power loss, memory reset or loss of communication parameters (e.g.

  • Page 50: Address Areas Of System Memory

    Memory concept 6.1 Memory areas and retentive address areas Retentive behavior of a DB STEP 7 For the Technology CPU, you can specify in or via SFC 82 "CREA_DBL" (parameter ATTRIB -> NON_RETAIN bit), whether a DB at POWER ON/OFF or RUN-STOP •...
  • Page 51 Memory concept 6.1 Memory areas and retentive address areas Address areas Description Flags This area provides memory for saving the intermediate results of a program calculation. Timers Timers are available in this area. Counters Counters are available in this area. Local data Temporary data in a code block (OB, FB, FC) is saved to this memory area while the block is being edited.
  • Page 52 Memory concept 6.1 Memory areas and retentive address areas Process image update The operating system updates the process image periodically. The figure below shows the sequence of this operation within a cycle. Figure 6-2 Sequence of operation within a cycle Local data Local data store: •...

  • Page 53: Properties Of The Micro Memory Card (Mmc)

    Memory concept 6.1 Memory areas and retentive address areas Caution All temporary variables (TEMP) of an OB and its nested blocks are stored in local data. When using complex nesting levels for block processing, you may cause an overflow in the local data area.
  • Page 54 Memory concept 6.1 Memory areas and retentive address areas Properties of an MMC The MMC ensures maintenance-free and retentive operation of these CPUs. Caution Data on a SIMATIC Micro Memory Card can be corrupted if you remove the card while it is being accessed by a write operation.

  • Page 55: Saving/Retrieving Whole Projects To/From The Micro Memory Card

    Memory concept 6.1 Memory areas and retentive address areas 6.1.6 Saving/retrieving whole projects to/from the Micro Memory Card Function principle Using the Save to Memory Card and Retrieve from Memory Card functions, you can save all project data to a SIMATIC Micro Memory Card, and retrieve these at a later time. For this operation, the SIMATIC Micro Memory Card can be located in a CPU or in the MMC adapter of a PG or PC.

  • Page 56: Memory Functions

    Memory concept 6.2 Memory functions Sample application When you assign more than one member of your service and maintenance department to perform maintenance tasks on a SIMATIC PLC, it may prove difficult to provide quick access to current configuration data to each staff member. However, CPU configuration data available locally on any CPU that is to be serviced can be accessed by any member of the service department.

  • Page 57: Downloading A User Program (Enhanced Handling)

    Memory concept 6.2 Memory functions Note The function "Download a user program from PG/PC" may be used only when the CPU is in the STOP state. Load memory is cleared if the load operation could not be completed due to power loss or illegal block data.
  • Page 58 Memory concept 6.2 Memory functions Deleting blocks STEP 7 When you delete a block, it is deleted from load memory. In , you can also delete blocks with the user program (DBs also with SFC 23 "DEL_DB"). RAM used by this block is released. Caution If you delete a technology data block, the associated drive stops.

  • Page 59: Cpu Memory Reset And Restart

    Memory concept 6.2 Memory functions 6.2.3 CPU memory reset and restart CPU memory reset After the insertion/removal of a Micro Memory Card, a CPU memory reset restores defined conditions for CPU restart (warm start). Technology CPU: • The CPU's memory management is rebuilt. •...

  • Page 60: Recipes

    Memory concept 6.3 Recipes Recipes Introduction A recipe represents a collection of user data. You can implement a simple recipe concept using static DBs. In this case, the recipes should have the same structure (length). One DB should exist per recipe. Processing sequence Recipe is written to load memory: STEP 7...

  • Page 61: Measured Value Log Files

    Memory concept 6.4 Measured value log files Note The active system functions SFC 82 to 84 (current access to the MMC) have a distinct influence on PG functions (block status, variable status, load block, upload, open, for example). This typically reduces performance (compared to passive system functions) by the factor in order to prevent data losses, do not exceed this maximum of delete/write operations.
  • Page 62 Memory concept 6.4 Measured value log files Measured value logging: • Before the data volume can exceed work memory capacity, you should call SFC 84 "WRIT_DBL" in the user program to swap measured values from the DB to load memory. Figure 6-5 Handling measured value log files •...

  • Page 63: Technology Data Blocks

    Memory concept 6.5 Technology data blocks Caution Data on a SIMATIC Micro Memory Card can be corrupted if you remove the card while it is being accessed by a write operation. In this case, you may have to delete the MMC on your PG, or format the card in the CPU.

  • Page 64: Memory Of The Integrated Technology Of The Cpu

    Memory concept 6.6 Memory of the integrated technology of the CPU Memory of the integrated technology of the CPU Memory utilization The following table contains typical values for the memory utilization in the integrated technology. The values refer to a CPU 315T-2 DP with firmware version V3.2 of the integrated technology: Technology CPU (6ES7 315- 6TG10-0AB0)
  • Page 65 Memory concept 6.6 Memory of the integrated technology of the CPU Calculation example The table shows the memory utilization for a sample configuration with a CPU 315T-2 DP with hardware version 02. The maximum memory utilization is 77% and is therefore less than the recommended maximum memory utilization.
  • Page 66 Memory concept 6.6 Memory of the integrated technology of the CPU Reference More detailed information on determining the actual memory assignment in the integrated S7-Technology technology can be found in the manual. Retentive address areas of the memory of the CPU integrated technology The values for the absolute encoder calibration are stored in a non-volatile memory in the integrated technology of the CPU.

  • Page 67: Cycle And Response Times

    Cycle and response times Overview Overview This section contains detailed information about the following topics: • Cycle time • Response time • Interrupt response time • Sample calculations Reference: Cycle time You can view the cycle time of your user program on the PG. Reference: Execution time S7-300 Instruction List for CPUs 31xC and 31x You can find information in the...

  • Page 68: Cycle Time

    Cycle and response times 7.2 Cycle time Cycle time 7.2.1 Overview Introduction This chapter explains what we mean by the term "cycle time", what it consists of, and how you can calculate it. Meaning of the term cycle time The cycle time represents the time that an operating system needs to execute a program, that is, one OB 1 cycle, including all program sections and system activities interrupting this cycle.
  • Page 69 Cycle and response times 7.2 Cycle time Sequence of cyclic program processing The table and figure below show the phases in cyclic program processing. Table 7-1 Cyclic program processing Step Operational sequence The operating system initiates cycle time monitoring. The CPU copies the values of the process image of outputs to the output modules. The CPU reads the status at the inputs of the input modules and then updates the process image of inputs.

  • Page 70: Calculating The Cycle Time

    Cycle and response times 7.2 Cycle time Increasing the Cycle Time Always make allowances for the extension of the cycle time of a user program due to: • Time-based interrupt processing • Process interrupt processing • Diagnostics and error handling •...
  • Page 71 Cycle and response times 7.2 Cycle time Operating system processing time at the scan cycle checkpoint The operating system processing time at the scan cycle checkpoint is 500 μs. This time is valid without: • Testing and commissioning routines, e.g. status/controlling of variables or block status functions •...

  • Page 72: Different Cycle Times

    Cycle and response times 7.2 Cycle time 7.2.3 Different cycle times Overview The length of the cycle time (T ) is not identical in each cycle. The following figure shows different cycle times, T and T is longer than T , because the cyclically scanned cyc1 cyc2...

  • Page 73: Communication Load

    Cycle and response times 7.2 Cycle time 7.2.4 Communication Load Configured communication load (PG/OP communication) The CPU operating system continuously provides a specified percentage of total CPU processing performance (time-sharing technology) for communication tasks. Processing performance not required for communication is made available to other processes. In the hardware configuration, you can set the load due to communications between 5% and 50%.
  • Page 74 Cycle and response times 7.2 Cycle time Physical cycle time depending on communication load The figure below describes the non-linear dependency of the physical cycle time on communication load. As an example, we have chosen a cycle time of 10 ms. Figure 7-4 Dependency of the Cycle Time on the Communication Load Influence on the physical cycle time...

  • Page 75: Cycle Time Extension As A Result Of Testing And Commissioning Functions

    Cycle and response times 7.2 Cycle time 7.2.5 Cycle time extension as a result of testing and commissioning functions Technology CPU runtimes The runtimes of the testing and commissioning functions are operating system runtimes, so they are the same for every CPU. Initially, there is no difference between process mode and testing mode.

  • Page 76: Response Time

    Cycle and response times 7.3 Response time Response time 7.3.1 Overview Definition of Response Time The response time is the time from an input signal being detected to changing an output signal linked to it. Variation The actual response time is lies somewhere between a minimum and maximum response time.
  • Page 77 Cycle and response times 7.3 Response time DP Cycle Times on the PROFIBUS-DP Network STEP 7 STEP 7 If you have configured your PROFIBUS DP network with , then will calculate the typical DP cycle time that must be expected. You can then view the DP cycle time of your configuration on the PG.

  • Page 78: Shortest Response Time

    Cycle and response times 7.3 Response time 7.3.2 Shortest response time Conditions for the shortest response time The following figure illustrates the conditions under which the shortest response time can be achieved. Figure 7-6 Shortest response time Calculation The (shortest) reaction time is made up as follows: •...

  • Page 79: Longest Response Time

    Cycle and response times 7.3 Response time 7.3.3 Longest response time Conditions for the longest response time The following figure shows you how the longest response time results. Figure 7-7 Longest response time Calculation The (longest) response time is made up as follows: •...

  • Page 80: Reducing The Response Time With Direct I/O Access

    Cycle and response times 7.4 Calculating method for calculating the cycle/response time 7.3.4 Reducing the response time with direct I/O access Reducing the Response Time You can reach faster response times with direct access to the I/O in your user program, e.g. with •...

  • Page 81: Interrupt Response Time

    Cycle and response times 7.5 Interrupt response time 3. Multiply both values by the CPU-specific extension factor of the user program processing time (see table "CPU communication services"). 4. Add the value of the interrupt-processing program sequences to the theoretical cycle time, multiplied by the number of triggering (or expected) interrupt events within the cycle time.
  • Page 82 Cycle and response times 7.5 Interrupt response time Calculation The formulae below show how you can calculate the minimum and maximum interrupt response times. Table 7-8 Process/diagnostic interrupt response times Calculation of the minimum and maximum interrupt reaction time Minimum interrupt reaction time of the CPU Maximum interrupt reaction time of the CPU + Minimum interrupt reaction time of the + Maximum interrupt reaction time of the signal...

  • Page 83: Reproducibility Of Time-Delay And Watchdog Interrupts

    Cycle and response times 7.6 Sample calculations 7.5.2 Reproducibility of Time-Delay and Watchdog Interrupts Definition of "Reproducibility" Delay interrupt: The deviation with time from the first instruction of the interrupt OB being called to the programmed interrupt time. Watchdog interrupt: The variation in the time interval between two successive calls, measures between the first instruction of the interrupt OB in each case.

  • Page 84: Calculation Example For The Response Time Of The Cpu 315T-2 Dp

    Cycle and response times 7.6 Sample calculations Calculation of the cycle time for the CPU 315T-2 DP The cycle time for the example results from the following times: • User program execution time: approx. 5 ms x CPU-specific factor 1.10 = approx. 5.5 ms •...
  • Page 85 Cycle and response times 7.6 Sample calculations User program According to the Instruction List, the user program has a runtime of 10.0 ms. Cycle time calculation The cycle time for the example results from the following times: • User program execution time: approx.

  • Page 86: Calculation Example For The Interrupt Response Time Of The Cpu 315T-2 Dp

    Cycle and response times 7.6 Sample calculations • Response times plus I/O delay: – Case 1: An output channel of the digital output module is set when a signal is received at the digital input. This produces a response time of: Response time = 40 ms + 4.8 ms = 44.8 ms.

  • Page 87: Technical Data

    Technical data General technical data 8.1.1 Dimension drawing Dimension drawing of Technology CPU S7-300 CPU Data: CPU 315T-2 DP Manual, 12/2005, A5E00427933-02...

  • Page 88: Technical Specifications Of The Micro Memory Card (Mmc)

    Technical data 8.1 General technical data 8.1.2 Technical specifications of the Micro Memory Card (MMC) Plug-in SIMATIC Micro Memory Cards Memory modules available: Table 8-1 Available MMCs Type Order number Comments MMC 4M 6ES7 953-8LM00-0AA0 MMC 8M 6ES7 953-8LP10-0AA0 Required for an operating system update 8.1.3 Clock Features and functions...

  • Page 89: Cpu 315T-2 Dp

    Technical data 8.2 CPU 315T-2 DP CPU 315T-2 DP Technical data Table 8-3 Technical data for the CPU 315T-2 DP Technical data CPU and version Order no. [MLFB] 6ES7 315-6TG10-0AB0 Hardware version • Firmware version (CPU) • V 2.4 Firmware version (integrated technology) •...
  • Page 90 Technical data 8.2 CPU 315T-2 DP Technical data Timers/counters and their retentive address areas S7 counters Retentive address areas • Configurable Default • From C0 to C7 Counting range • 0 to 999 IEC Counters Type • Quantity • Unlimited (limited only working memory) S7 timers Retentive address areas...
  • Page 91 Technical data 8.2 CPU 315T-2 DP Technical data Technological functions Maximum number of simultaneously active • jobs Maximum number of simultaneously • assigned job data compartments The following technology functions each occupy (as long as they are active) one job data compartment: "MC_ReadPeriphery"...
  • Page 92 Technical data 8.2 CPU 315T-2 DP Technical data Buffered period • Typically 6 weeks (at an ambient temperature of 104 °F) Accuracy Deviation per day: < 10 s • Operating hours counter Number • Value range • 2 31 hours (if SFC 101 is used) Granularity 1 hour...
  • Page 93 Technical data 8.2 CPU 315T-2 DP Technical data User data per job • Max. 76 bytes Consistent data 76 bytes (for X_SEND or X_RCV) 76 bytes (for X_PUT or X_GET as the server) S7 communication As server • As client •...
  • Page 94 Technical data 8.2 CPU 315T-2 DP Technical data As server As client Yes (via CP and loadable FBs) Transmission rates • Max. 12 Mbps DP master Services PG/OP communication • Routing • Global data communication • S7 basic communication • S7 communication •...
  • Page 95 Technical data 8.2 CPU 315T-2 DP Technical data Routing • Global data communication • S7 basic communication • S7 communication • Constant bus cycle time • SYNC/FREEZE • DPV1 • Transmission speed Up to 12 Mbps Number of DP slaves Address area per station Max.

  • Page 96: Integrated Inputs/Outputs For Technology

    Technical data 8.3 Integrated Inputs/Outputs for Technology Integrated Inputs/Outputs for Technology 8.3.1 Arrangement of integrated inputs/outputs for integrated technology Introduction The Technology CPU has 4 digital inputs and 8 digital outputs integrated. You use these inputs and outputs for technology functions, e.g. reference point acquisition (reference cams) or high-speed output cam switching signals.

  • Page 97: Technical Specifications Of Digital Inputs

    Technical data 8.3 Integrated Inputs/Outputs for Technology 8.3.2 Technical specifications of digital inputs Technical specifications The digital inputs are provided for technology functions such as reference point acquisition (reference cam). They can also be utilized for the STEP7 user program with FB "MC_ReadPeriphery".

  • Page 98: Technical Specifications Of Digital Outputs

    Technical data 8.3 Integrated Inputs/Outputs for Technology Technical specifications with signal "1" • Typ. 7 mA Input delay at "0" to "1" • Typ. 10 µs with "1" to "0" • Typ. 10 µs Input characteristic curve To IEC 1131, Type 1 Connection of 2-wire reference cam 8.3.3 Technical specifications of digital outputs...
  • Page 99 Technical data 8.3 Integrated Inputs/Outputs for Technology Technical specifications Diagnostic functions Data for the selection of an actuator for standard Output voltage with signal "0" • max. 3 V with signal "1" • min. (2 L+) - 2.5 V Output current with signal "1"...
  • Page 100 Technical data 8.3 Integrated Inputs/Outputs for Technology S7-300 CPU Data: CPU 315T-2 DP 8-14 Manual, 12/2005, A5E00427933-02...
  • Page 101 Scope Who should read this chapter? Are you already using a CPU from the SIMATIC S7-300 series and now want to upgrade to a Technology CPU? Please note that problems may occur when you download your user program to the "new"...

  • Page 102: Information For The Changeover To The Technology Cpu

    Information for the Changeover to the Technology CPU 9.2 Changed behavior of certain SFCs ... then please read the following information regarding migration to the Technology CPU Changed behavior of certain SFCs SFC 13, SFC 56 and SFC 57 which work asynchronously... Some of the SFCs that work asynchronously, when used on CPUs 312 IFM to 318-2 DP, were always, or under certain conditions, processed after the first call ("quasi-synchronous").
  • Page 103 Information for the Changeover to the Technology CPU 9.2 Changed behavior of certain SFCs SFC 20 "BLKMOV" In the past, this SFC could be used with CPUs 312 IFM to 318-2 DP to copy data from a non runtime-related DB. SFC 20 no longer has this functionality with the Technology CPU SFC 83 "READ_DBL"...

  • Page 104: Interrupt Events From Distributed I/Os While The Cpu Status Is In Stop

    Information for the Changeover to the Technology CPU 9.3 Interrupt events from distributed I/Os while the CPU status is in STOP Interrupt events from distributed I/Os while the CPU status is in STOP Interrupt events from distributed I/Os while the CPU status is in STOP With the new DPV1 functionality (IEC 61158/ EN 50170, volume 2, PROFIBUS), the handling of incoming interrupt events from the distributed I/Os while the CPU status is in STOP has also changed.

  • Page 105: Reusing Existing Hardware Configurations

    Information for the Changeover to the Technology CPU 9.6 Reusing existing hardware configurations • The interface module is also modeled as a separate, virtual slot for some slaves (e.g. CPU as intelligent slave or IM 153) in which case it is assigned to virtual slot 2 with a separate address.

  • Page 106: Using Consistent Data Areas In The Process Image For Dp Slaves

    Information for the Changeover to the Technology CPU 9.8 Using consistent data areas in the process image for DP slaves Using consistent data areas in the process image for DP slaves Using consistent data areas in the process image for DP slaves A data area is consistent if it can be read or written to from the operating system as a consistent block.

  • Page 107: Fms/Cps With Their Own Mpi Address In A Technology Cpu Rack

    Information for the Changeover to the Technology CPU 9.11 FMs/CPs with their own MPI address in a Technology CPU rack 9.11 FMs/CPs with their own MPI address in a Technology CPU rack 9.11 FMs/CPs with their own MPI address in a Technology CPU rack Table 9-2 Behavior of FMs/CPs with their own MPI address All CPUs except for CPU 317-2 DP,...
  • Page 108 Information for the Changeover to the Technology CPU 9.12 Information about interface X3 DP(DRIVE) No diagnosis on DP(DRIVE) Remember that you cannot evaluate diagnostic data from DP(DRIVE) in your STEP 7 user program if you are using the Technology CPU. However, with your PC/PG connected to PROFIBUS DP, you can use the "routing"...

  • Page 109: List Of Abbreviations

    Appendix A List of abbreviations List of abbreviations Table A-1 List of abbreviations Abbreviation Explanation Automation system Output Operator control and process monitoring Data block Distributed I/Os DP (drive) Distributed I/Os for drives Input Expansion Unit Function block Function Global data Human Machine Interface Interface module Flags...
  • Page 110 Appendix A A.1 List of abbreviations Abbreviation Explanation Scan cycle check point S7-300 CPU Data: CPU 315T-2 DP Manual, 12/2005, A5E00427933-02...

  • Page 111: Glossary

    Glossary Activation/deactivation of slaves You activate a DP slave with the SFC 12 "D_ACT_DP" and therefore include it in the cyclic processing. Deactivating a slave removes the DP slave from the cyclic processing. Address An address represents the identifier of a specific address or address range. Examples: input I 12.1;...
  • Page 112 Glossary Cold restart On CPU startup (e.g. after it is switched from STOP to RUN via the mode selector or with POWER ON), OB100 (restart) is initially executed, prior to cyclic program execution (OB1). On restart, the input process image is read in and the STEP 7 user program is executed, starting at the first command in OB1.
  • Page 113 Glossary Diagnostics System diagnostics Diagnostics buffer The diagnostics buffer is a buffered memory area in the CPU. It stores diagnostic events in the order of their occurrence. DP (drive) PROFIBUS interface that is controlled by the integrated technology of the CPU isochronously (and therefore also equidistant).
  • Page 114 Glossary Execution level Execution levels form the interface between the operating system of the CPU and the user program. The sequence for executing the blocks of the user program is specified in the execution levels. Flag Flags are part of the CPU's system memory. They store intermediate results of calculations. They can be accessed in bit, byte, word or double word operations.
  • Page 115 Glossary Global data Global data can be addressed from any code block (FC, FB, OB). These include flag F, inputs I, outputs Q, timers, counters and data blocks DB. Global data can be accessed either absolutely or symbolically. Global data communication Global data communication is a method of transferring global data between CPUs (without CFBs).
  • Page 116 Glossary Local data Data, temporary Master When a master is in possession of the token, it can send data to other nodes and request data from other nodes (= active node). Micro memory card (MMC) Micro memory cards are memory media for CPUs and CPs. The difference to the memory card is the smaller size.
  • Page 117 Glossary Parameter 1. Variable of a STEP 7 code block 2. Variable for setting the response of a module (one or several per module). As delivered, each module has an appropriate default setting that can be changed via configuration in STEP 7.
  • Page 118 Glossary Retentive address areas A memory area is considered retentive if its contents are retained even after a power loss and transitions from STOP to RUN. The non-retentive area of the flags, timers and counters is reset following a power failure and a transition from the STOP mode to the RUN mode. Retentive can be the: •...
  • Page 119 Glossary Signal module Signal modules (SMs) form the interface between the process and the automation system. There are digital input and output modules (input/output module, digital) and analog input and output modules (input/output module, analog). Signal status list The system status list contains data that describes the current status of an S7-300. You can always use this list to obtain an overview of: •...
  • Page 120 Glossary System memory System memory is an integrated RAM memory in the CPU. System memory contains the address areas (e.g. timers, counters, flags) and data areas that are required internally by the operating system (for example, communication buffers). Technology configuration data STEP 7 The configuration that you have created with is stored in the technology...
  • Page 121 Glossary User program In SIMATIC, a distinction is made between the operating system of the CPU and user programs. The latter are created by the STEP 7 programming software in the available programming languages (ladder logic and statement list) and are stored in code blocks. Data is stored in data blocks.
  • Page 122 Glossary S7-300 CPU Data: CPU 315T-2 DP Glossary-12 Manual, 12/2005, A5E00427933-02...

  • Page 123: Index

    Index 5 VDC, 3-3, 4-6 CE marking, 1-2 Central processing unit, 4-2 Classification Documentation, 1-2 Clock, 8-2 Access Code block, 6-1 acyclic, 5-4 COMBIMASTER, 2-2, 5-3 Activation/deactivation, 9-3 Commissioning, 4-5 Acyclical access, 5-4 Communication, 5-1 Address area, 4-5, 6-2, 6-4 Data consistency, 5-13 Addressing, 4-4 Communication Load...
  • Page 124 Index CPU memory reset, 6-12 System block, 5-5 C-tick mark, 1-2 Drive interface Cycle time analog, 5-4 Calculation, 7-4 analog, ADI4, 2-2 Definition, 7-2 Extension, 7-3 Maximum Cycle Time, 7-6 Process image, 7-2 Elements Sample calculation, 7-16 CPU, 3-1 Sequence of cyclic program processing, 7-2 Enhanced handling Time-Sharing Model, 7-2 Downloading the user program, 6-11...
  • Page 125 Index Integrated inputs and outputs for technology, 2-3, 3- Memory area, 6-1 1, 4-5 Memory concept, 6-1 Integrated Inputs/Outputs for Technology Memory function, 6-10 Layout, 8-9 Download of blocks, 6-11 Integrated technology, 4-4 Memory module, 3-2 Interface, 2-1, 4-3, 5-1 Memory objects Which devices can I connect to which Retentive behavior, 6-3...
  • Page 126 Index on DP(DRIVE), 4-2, 9-7 Memory objects, 6-3 PG communication, 5-6, 5-7 Technology data block, 6-3, 6-4 PLCopen, 2-1 Retentive data block, 6-2 Power supply, 4-2 Retentive memory, 6-2 Process image, 6-2 reuse of inputs and outputs, 6-5 Hardware configurations, 9-5 Process interrupt Routing, 5-10 Processing, 7-15...
  • Page 127 Index SIMODRIVE, 2-2 Processing sequence, 6-17, 6-18 SIMODRIVE 611 universal, 2-2, 5-3 Retentive behavior, 6-4 SIMODRIVE POSMO, 2-2, 5-3 Technology DB SINAMICS, 2-2, 5-4 Retentive behavior, 6-3 Single-tier configuration, 2-3 Technology objects, 2-1 Size Technology system data, 6-1 Load memory, 6-1 Technology-CPU Slave, 5-2 Load memory design, 9-5...

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