Soldering Of Through-Hole Mount Packages; Introduction To Soldering Through-Hole Mount Packages; Soldering By Dipping Or By Solder Wave; Manual Soldering - Philips TDA8950 Product Data Sheet

2 × 150 w class-d power amplifier
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16. Soldering of through-hole mount packages

16.1 Introduction to soldering through-hole mount packages

16.2 Soldering by dipping or by solder wave

16.3 Manual soldering

TDA8950_2
Product data sheet
temperature
MSL: Moisture Sensitivity Level
Fig 30. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
"Surface mount reflow soldering description" .
This text gives a very brief insight into wave, dip and manual soldering.
Wave soldering is the preferred method for mounting of through-hole mount IC packages
on a printed-circuit board.
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb
or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300 C and 400 C, contact may be up to 5 seconds.
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
Rev. 02 — 11 June 2009
TDA8950
2
150 W class-D power amplifier
peak
temperature
001aac844
stg(max)
© NXP B.V. 2009. All rights reserved.
time
). If the
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