Technical Brief; Digital Main Processor - LG -T370 Service Manual

3. TECHNICAL BRIEF

3.1 Digital Main Processor

External
M em ory-IF
ARM1176
cache
PA
FEM
Low -
Power
D CXO
LGE Internal Use Only
SD/ M M C SIM
64 - bit bus 32 - b it bus
GSM U SIF
RAM ROM
DA C
GM SK
SD
PLL IF
AD C D SP
32 kH z
R F PM U
XO
LDO blocking caps, 100nF
Figure. 3.1.1 X-Gold tm 215 Hardware Block Diagram
M easurem ent
C IF Keypad
IF ( A/D)
U SB 2.0
D CC FM - radio
F S
GSM
IR - M emory GPTU
C ip her
TEAKLite
R F
I² S / D AI
C ontrol
LR TC LPM U VA NA
L SIM LAU X VM M C
Vcore Vibrator VU SB
B ack - DC/ D C
C harge
lig ht Buck
1,8V
1.0V...
1 2
10 µF
min.
BC 847 S
D C/ DC
6
T 1
( 0 V ) 3 .05 V ... 5 .1 V (6 V)
0 . 15 5 % ZXTP 25020
for example
Battery Charger
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3. TECHNICAL BRIEF
D igital -
M icrophone
HSL
Stereo
HSR
H eadset
EPP
Earpiece
EPN
LSP
Loud -
speaker
LSN
M IC P1
M IC N1
M ic
M U X
M IC P2
M IC N2
M icSupply
VM IC
generation
VU M IC
C harge Pum p
( negative voltage for
bipolar audio out )
1.8V ~ 2 .5V
135 mV ... 600mV
4 k3
4 7.5 µA
5
3
127 k
4k 7
470
VCHARGE 4. 5 V ... 20V
Only for training and service purposes
2x 16 Ohm
2x 30 m W
16 Ohm
100 m W
8 Ohm
700 m W