LG -T370 Service Manual page 102

Process
Disassemble
Main Board
Cut off shield
can
Cut 4-points that checked
red quadrangle
Remove
Memory
Melt solder via heat-gun.
LGE Internal Use Only
Detail Guide
Main Board
Apply heat to
shield-can that
removing part
- 10 -
4. TROUBLE SHOOTING
Detach gold gasket tape
Shield-can cut
off Main board
Polish up Memory IC pad area
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Only for training and service purposes
Description
1. Disassemble
the main board
from the Phone.
. Detach gold
gasket tape from
shield-can via
pincette.
1. Cut 4-point of
shield-can that
checked red
quadrangle via
nipper.
. Flowing iron
through applying
heat. In same
time lift a piece
of shield can with
a pincette.
3. Separated
shield-can throw
away.
1. Apply heat via
heat-gun.
. Pick up
through pincette
when complete
melting solder.
3. Polish-up
around of
Memory IC pad
via Solder paste
for deliberate
mounting
Memory IC.