Overview; Pentium ® Iii Processor; Pentium ® Ii Or Pentium ® Iii Processor - EPOX EP-6WEA4 User Manual

Introduction EP-6WEA4/4I

Overview

Pentium II or Pentium III Processor
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The Pentium II or Pentium III Processor (The Pentium III Processor as 350~600/
100MHz and 533~733/133MHz speed or above with 512K/256K-L2 cache
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Versions.) is the follow-on to the Pentium Processor. The Pentium II or Pentium
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III Processor, like the Pentium Pro processor, implements a Dynamic Execution
micro-architecture -- a unique combination of multiple branch prediction, data flow
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analysis, and speculative execution. This enables the Pentium II/III Processor to
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deliver higher performance than the Pentium processor, while maintaining binary
compatibility with all previous Intel architecture processors.
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A significant feature of the Pentium II or Pentium III Processor, from a system
perspective, is the built-in direct multiprocessing support. In order to achieve
multiprocessing, and maintain the memory and I/O bandwidth to support it, new
system designs are needed. For systems with dual processors, it is important to
consider the additional power burdens and signal integrity issues of supporting
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multiple loads on a high speed bus. The Pentium II or Pentium III Processor
card supports both uni-processor and dual processor implementations.
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The Pentium II or Pentium III Processor utilizes Single Edge Contact (S.E.C.)
(Figure 1) cartridge packaging technology. The S.E.C. cartridge allows the L2
cache to remain tightly coupled to the processor, while maintaining flexibility
when implementing high performance processors into OEM systems. The second
level cache is performance optimized and tested at the cartridge level. The S.E.C.
cartridge utilizes surface mounted core components and a printed circuit board
with an edge finger connection. The S.E.C. cartridge package introduced on the
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Pentium II Processor will also be used in future Slot 1 processors.
The S.E.C. cartridge has the following features: a thermal plate, a cover and a PCB
with an edge finger connection. The thermal plate allows standardized heatsink
attachment or customized thermal solutions. The thermal plate enables a reusable
heatsink to minimize fit issues for serviceability, upgradeability and replacement.
The full enclosure also protects the surface mount components. The edge finger
connection maintains socketabilty for system configuration. The edge finger
connector is denoted as 'Slot 1 connector' in this and other documentation.
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