Sony MEX-BT5100 Service Manual page 2

MEX-BT5100
Wireless Communication
Communication System:
Bluetooth Standard version 2.0
Output:
Bluetooth Standard Power Class 2 (Max. +4 dBm)
Maximum communication range:
Line of sight approx. 10 m (32.8 ft)*
Frequency band:
2.4 GHz band (2.4000 – 2.4835 GHz)
Modulation method: FHSS
2
Compatible Bluetooth Profiles* :
A2DP (Advanced Audio Distribution Profile)
AVRCP (Audio Video Remote Control Profile)
HFP (Handsfree Profile)
OPP (Object Push Profile)
*1 The actual range will vary depending on factors
such as obstacles between devices, magnetic
fields around a microwave oven, static electricity,
reception sensitivity, antenna's perfomance,
operating system, software application, etc.
*2 Bluetooth standard profiles indicate the purpose of
Bluetooth communication between devices.
Power amplifier section
Outputs: Speaker outputs (sure seal connectors)
Speaker impedance: 4 – 8 ohms
Maximum power output: 52 W × 4 (at 4 ohms)
General
Outputs:
Audio outputs terminal (front/rear)
Subwoofer output terminal (mono)
Power antenna relay control terminal
Power amplifier control terminal
Inputs:
Telephone ATT control terminal
Illumination control terminal
BUS control input terminal
BUS audio input/AUX IN terminal
Remote controller input terminal
Antenna input terminal
Tone controls:
Low: ±10 dB at 60 Hz or 100 Hz (XPLOD)
Mid: ±10 dB at 500 Hz or 1 kHz (XPLOD)
High: ±10 dB at 10 kHz or 12.5 kHz (XPLOD)
Power requirements: 12 V DC car battery
(negative ground)
Dimensions: Approx. 178 × 50 × 183 mm
1 × 2 × 7 1
(7 / / in) (w/h/d)
8 4
Mounting dimensions: Approx. 182 × 53 × 162 mm
1 × 2 1 × 6 1
(7 / / / in) (w/h/d)
4 8 2
Mass: Approx. 1.2 kg (2 lb 11 oz)
Supplied accessories:
Card remote commander: RM-X301 (US, Canadian)
Card remote commander: RM-X302 (AEP, UK)
Card remote commander: RM-X303 (E)
Parts for installation and connections (1 set)
Your dealer may not handle some of the above listed
accessories. Please ask the dealer for detailed
information.
MPEG Layer-3 audio coding technology and
patents licensed from Fraunhofer IIS and Thomson.
Note
This unit cannot be connected to a digital preamplifier
or an equalizer which is Sony BUS system compatible.
Design and specifications are subject to change
without notice.
CAUTION
Use of controls or adjustments or performance of procedures other than
those specifi ed herein may result in hazardous radiation exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270 °C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
2
1
• AEP, UK, E model
This label is located on the bottom of the
chassis.
CAUTION – CLASS 1M INVISIBLE LASER RADIATION
WHEN OPEN.
DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS.
SAFETY-RELATED COMPONET WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COM- POSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
WITH SONY PARTS