6.6 Humidity or liquid damage
Diagnosis code IRIS:
-
Boards with oxidation on the keypad side do not have to be scrapped if the vias
are not affected by green oxidation layer.
-
Boards with humidity damages on the component side have to be scrapped.
Look at all electronic components on the back side. Do not open the RF-Part.
Remaining flux on the component side could look similar to a humidity damage (white
deposits) but it will disappear when heating it up with a hot air blower.
no scrap:
Scrap:
Via
Confidential
Version 1.0
61000 (DEVICE / MOISTURE DAMAGE)
Clean board
Check also area under display!
19
Communications
COM MD CC GRM T
J. Junggebauer
July 2005