Circuit Descriptions, Abbreviation List, And Ic Data Sheets - Philips FTL2.1E Service Manual

Circuit Descriptions, Abbreviation List, and IC Data Sheets

9. Circuit Descriptions, Abbreviation List, and IC Data Sheets
Index of this chapter:
9.1 Introduction
9.2 Power Supply LCD
9.3 Video
9.4 Synchronisation
9.5 Audio
9.6 Control
9.7 Proximity Sensor (if present)
9.8 Ambient Light (if present)
9.9 Software Upgrading
9.10 Abbreviation list
9.11 IC Data Sheets
Note:
• Only new (not recently published) circuits are described
here. For the other circuit descriptions, see a.o. the FTL13
and EM5.3 manuals.
• In the following text, the model year 2003 refers to the
FTL13x chassis, while the model year 2004 refers to the
new FTL2.x chassis.
• Figures can deviate slightly from the actual situation, due
to different set executions.
• For a good understanding of the following circuit
descriptions, please use the wiring, block and circuit
diagrams. Where necessary, you will find a separate
drawing for clarification.
9.1 Introduction
This chassis contains, compared to its predecessor, the
following new features/components:
• New Small Signal Board (SSB) with lower height due to
a.o. flat mounted tuners. This board is completely shielded
(i.s.o. only the FBX).
• FEM (Falconic Embedded Memories): this is a new
Falconic IC with internal Field memories and jagged line
removal.
• Improved 2D/3D Comb filter: The new key components
are Columbus and SDRAM. When SDRAM is used, a 3D
comb filter (or temporal comb filtering) is possible. Without
SDRAM, only 2D comb filtering (or spatial comb filtering) is
possible. This is improved with respect to the previous 2D
comb filter.
• Improved noise reduction: This is a second function of
the Columbus and SDRAM. Noise reduction is possible
without SDRAM (2D) and with SDRAM (3D).
• Pixel Plus 2: Eagle 1B is replaced by Eagle 1C.
– Algorithms for Horizontal LTI and Vertical LTI are
improved.
– "Thin Line Control" as part of the sharpness control.
– "Face Depending Peaking" should allow less
sharpness in faces different from the rest of the picture.
This could be used to anti age faces versus the rest of
the picture.
– "Vivid Colours 1" will result in more saturated colours.
– The range/amount of "Blue Stretch" is extended.
– More steps of "Green Enhancement".
– Improved "Colour Dependent Sharpness".
– Increased range of skin gain and skin tone.
• Proximity sensor: to detect a motion when the customer
is approaching the set, and then to light up the LEDs on the
set for 6 s (detection area is 1.5 - 2 m).
• Improved/new AutoTV functions: AutoTV 2004 has
some new hardware configurations. Applying an LCD
panel requires to have contrast reserve and backlight
regulation. Applying a PDP panel requires to have contrast
reserve as well (no backlight regulation). The Eagle 1C is
detected automatically. Columbus improved noise
reduction is used when the Columbus is present.
• Ambient Light: To be able to control lamps at the rear of
the TV with respect to the measured ambient light level
FTL2.1E, FTL2.2E
from the light sensor or the picture content, a control output
from AutoTV has been foreseen.
• DVI input for Europe, HDMI input for NAFTA and AP.
The chassis consists of a full sized SSB, two Power Supply
boards (one for the stand-by supply and one for the main
supply), and some smaller PWBs for I/O and Control functions.
The main functionalities are:
• Stand-by Supply: The Stand-by Supply is a new board
that also includes the (class D) Audio Amplifier and the
power supply interfacing to the LCD panel.
• Main Supply: LLC power supply, based on the one used
in the plasma monitors (FMxx chassis). This supply (single
sided) is built up very conventional, with hardly any surface
mounted components on the copper side.
• SSB: Core TV functionalities, being TXT/control, video and
audio decoding, feature box, video featuring, and sync/
geometry control. The SSB is a high tech module (four
layer, two sides reflow technology, full SMC) with very high
component density and full shielding for EMC-reasons.
Despite this, it is designed in such a way, that repair on
component level is possible. To achieve this, attention was
paid to:
– Clearance around surface mounted ICs (for replacing).
– Detailed diagnostics and fault finding is possible via
ComPair.
– Software upgrading (only for main software) is possible
via ComPair.
On the next drawings, it is indicated where all the functional
cells are located on the SSB (mind you that this is just an
indication):
9. EN 127