Table Of Contents - Sony XR-M500R Service Manual

Fm/am (mw/lw) cassette car stereo
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Power amplifier section
Outputs
Speaker outputs
Speaker impedance
4 - 8 ohms
Maximum power output 50 W × 4 (at 4 ohms)
General
Outputs
Audio output (2) (M500R)
Audio output (3) (M550)
Power aerial relay control
lead
Power amplifier control
lead
Inputs
Telephone ATT control
lead
Illumination control lead
Bass ±9 dB at 100 Hz
Tone controls
Treble ±9 dB at 10 kHz
Power requirements
12 V DC car battery
(negative earth)
Dimensions
Approx. 178
× 2 × 7
(7
1
/
8
(w/h/d)
Approx. 182 × 53 × 163 mm
Mounting dimensions
× 2
(7
1
/
4
(w/h/d)
Mass
Approx. 1.3 kg (2lb. 14 oz.)
Supplied accessories
Card remote commander
RM-X96 (XR-M500R)
RM-X94 (XR-M550)
Parts for installation and
connections (1 set)
Design and specifications are subject to change
without notice.
2
× 50 × 182 mm
4
/
in.)
1
× 6
1
/
1
/
in.)
8
2

TABLE OF CONTENTS

1.
2.
GENERAL
Location of Controls (XR-M500R) ................................ 4
Setting the Clock ............................................................. 4
Changing the Sound and Display Setting ....................... 4
Locations of Controls (XR-M550) ................................. 5
Setting the Clock ............................................................. 5
Changing the Sound and Display Setting ....................... 5
Installation (XR-M500R) ................................................ 6
Installation (XR-M550) .................................................. 7
Connections (XR-M500R) .............................................. 8
Connections (XR-M550) ................................................ 12
3.
......................................................... 15
4.
................................................................. 19
5.
6.
Tape Deck Section .......................................................... 24
Tuner Section .................................................................. 25
7.
7-2. Block Diagram - MAIN Section - ................................ 28
- DISPLAY/BUS CONTROL Section - ....................... 29
Schematic Diagrams ....................................................... 31
7-6. Printed Wiring Board
- MAIN Board (Component Side) - .............................. 32
- MAIN Board (Conductor Side) - ................................ 33
7-12. Printed Wiring Board -SUB Board - ............................ 38
7-13. Schematic Diagram - SUB Board - .............................. 39
7-15. Schematic Diagram - DISPLAY Board - ..................... 41
7-16. IC Pin Function Description ........................................... 44
8.
9.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
............................................... 3
....................... 24
................................................ 51
............................... 55

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