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Intel® Reference Thermal Solution—Intel
Dual-Core E2160 Processor
Figure 11.
PICMG 1.3 Copper Heatsink
Based on lab test data, the case-to-ambient (Ψ
to be 0.356 °C/W with 18 CFM of airflow through the heatsink fins. This will allow a
maximum T
described in the processor datasheet. The estimated performance for additional
airflows is shown in
October 2007
Order Number: 315279 - 003US
®
TM
Core
2 Duo E6400, E4300, and Intel
of 39 °C and meet the processors Thermal Profile specification as
LA
Figure
12.
®
TM
Intel
Core
2 Duo E6400, E4300, and Intel
®
®
Pentium
) performance of heatsink was found
CA
®
®
Pentium
Dual-Core E2160 Processor
TDG
35
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