Table Of Contents - Intel E2160 - Cpu Pentium Dual-Core 1.80Ghz Fsb800Mhz 1M Lga775 Tray Design Manual

® TM
Intel Core 2 Duo E6400, E4300, and Intel
Contents
1.0 Introduction .............................................................................................................. 7
1.1 Document Goals and Scope .................................................................................. 7
1.1.1 Importance of Thermal Management........................................................... 7
1.1.2 Document Goals....................................................................................... 7
1.1.3 Document Scope ...................................................................................... 7
1.2 References ......................................................................................................... 9
1.3 Definition of Terms .............................................................................................. 9
2.0 Processor Thermal/Mechanical Information ............................................................ 11
2.1 Mechanical Requirements ................................................................................... 11
2.1.1 Processor Package.................................................................................. 11
2.1.2 Heatsink Attach ..................................................................................... 12
2.2 Thermal Requirements ....................................................................................... 14
2.2.1 Processor Case Temperature.................................................................... 14
2.2.2 Thermal Profile ...................................................................................... 15
2.2.3 T
CONTROL
2.3 Heatsink Design Considerations........................................................................... 17
2.3.1 Heatsink Size......................................................................................... 17
2.3.2 Heatsink Mass........................................................................................ 18
2.3.3 Package IHS Flatness.............................................................................. 18
2.3.4 Thermal Interface Material....................................................................... 18
2.4 System Thermal Solution Considerations .............................................................. 19
2.4.1 Chassis Thermal Design Capabilities.......................................................... 19
2.4.2 Improving Chassis Thermal Performance ................................................... 19
2.4.3 Summary .............................................................................................. 19
2.5 System Integration Considerations ...................................................................... 20
3.0 Thermal Metrology .................................................................................................. 21
3.1 Characterizing Cooling Performance Requirements ................................................. 21
3.1.1 Example................................................................................................ 22
3.2 Processor Thermal Solution Performance Assessment ............................................. 23
3.3 Local Ambient Temperature Measurement Guidelines ............................................. 23
3.4 Processor Case Temperature Measurement Guidelines............................................ 25
4.0 Thermal Management Logic and Thermal Monitor Feature ....................................... 26
4.1 Processor Power Dissipation................................................................................ 26
4.2 Thermal Monitor Implementation......................................................................... 26
4.2.1 PROCHOT# Signal .................................................................................. 27
4.2.2 Thermal Control Circuit ........................................................................... 27
4.2.3 Thermal Monitor 2 .................................................................................. 28
4.2.4 Operation and Configuration .................................................................... 29
4.2.5 On-Demand Mode .................................................................................. 30
4.2.6 System Considerations............................................................................ 30
4.2.7 Operating System and Application Software Considerations.......................... 31
4.2.8 THERMTRIP# Signal ............................................................................... 31
4.2.9 Cooling System Failure Warning ............................................................... 31
4.2.10 Digital Thermal Sensor............................................................................ 31
4.2.11 Platform Environmental Control Interface (PECI) ........................................ 32
5.0 Intel® Reference Thermal Solution.......................................................................... 33
5.1 Thermal Solution Requirements........................................................................... 33
5.2 PICMG 1.3 Form Factor ...................................................................................... 34
5.3 ATX/BTX form factors ........................................................................................ 36
October 2007
Order Number: 315279 - 003US
® ®
Pentium Dual-Core E2160 Processor
................................................................................................. 16
® TM
Intel Core 2 Duo E6400, E4300, and Intel
® ®
Pentium Dual-Core E2160 Processor
TDG
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