System Integration Considerations - Intel E2160 - Cpu Pentium Dual-Core 1.80Ghz Fsb800Mhz 1M Lga775 Tray Design Manual

Intel
• Surface area of the heatsink.
• Heatsink material and technology.
• Volume of airflow over the heatsink surface area.
• Development of airflow entering and within the heatsink area.
• Physical volumetric constraints placed by the system.
2.5

System Integration Considerations

Manufacturing with Intel® Components using 775-Land LGA Package and LGA775
Socket documentation provides Best Known Methods for all aspects of LGA775 socket
based platforms and systems manufacturing. Of particular interest for package and
heatsink installation and removal is the System Assembly module. A video covering
system integration is also available. Contact your Intel field sales representative for
more information.
® TM
Intel Core 2 Duo E6400, E4300, and Intel
TDG
20
® TM
Core 2 Duo E6400, E4300, and Intel
® ®
Pentium Dual-Core E2160 Processor
® ®
Pentium Dual-Core E2160 Processor—Processor
Thermal/Mechanical Information
Order Number: 315279 -003US
October 2007