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Intel
For the PICMG 1.3 server form factor, it is recommended to use:
• The PICMG 1.3 motherboard keep-out footprint definition and height restrictions for
enabling components, defined for the platforms designed with the LGA775 socket
in Appendix E of this design guide.
• The motherboard primary side height constraints are located at http://picmg.org/
specifications.stm.
The resulting space available above the motherboard is generally not entirely available
for the heatsink. The target height of the heatsink must take into account airflow
considerations (for fan performance for example) as well as other design considerations
(air duct, etc.).
2.3.2
Heatsink Mass
With the need to push air cooling to better performance, heatsink solutions tend to
grow larger (increase in fin surface) resulting in increased mass. The insertion of highly
thermally conductive materials like copper to increase heatsink thermal conduction
performance results in even heavier solutions. As mentioned in Section 2.1, the
heatsink mass must take into consideration the package and socket load limits, the
heatsink attach mechanical capabilities and the mechanical shock and vibration profile
targets. Beyond a certain heatsink mass, the cost of developing and implementing a
heatsink attach mechanism that can ensure the system integrity under the mechanical
shock and vibration profile targets may become prohibitive.
2.3.3
Package IHS Flatness
The package IHS flatness for the product is specified in the datasheet and can be used
as a baseline to predict heatsink performance during the design phase.
Intel recommends testing and validating heatsink performance in full mechanical
enabling configuration to capture any impact of IHS flatness change due to combined
socket and heatsink loading. While socket loading alone may increase the IHS warpage,
the heatsink preload redistributes the load on the package and improves the resulting
IHS flatness in the enabled state.
2.3.4
Thermal Interface Material
Thermal interface material application between the processor IHS and the heatsink
base is required to improve thermal conduction from the IHS to the heatsink. Many
thermal interface materials can be pre-applied to the heatsink base prior to shipment
from the heatsink supplier and allow direct heatsink attach, without the need for a
separate thermal interface material dispense or attach process in the final assembly
factory.
All thermal interface materials should be sized and positioned on the heatsink base in a
way that ensures the entire processor IHS area is covered. It is important to
compensate for heatsink-to-processor attach positional alignment when selecting the
proper thermal interface material size.
When pre-applied material is used, it is recommended to have a protective application
tape over it. This tape must be removed prior to heatsink installation.
®
TM
Intel
Core
2 Duo E6400, E4300, and Intel
TDG
18
®
TM
Core
2 Duo E6400, E4300, and Intel
®
®
Pentium
Dual-Core E2160 Processor
®
®
Pentium
Dual-Core E2160 Processor—Processor
Thermal/Mechanical Information
Order Number: 315279 -003US
October 2007
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