Processor Thermal/Mechanical Information; Mechanical Requirements; Processor Package; Package Ihs Load Areas - Intel E2160 - Cpu Pentium Dual-Core 1.80Ghz Fsb800Mhz 1M Lga775 Tray Design Manual

Processor Thermal/Mechanical Information—Intel
®
Pentium Dual-Core E2160 Processor
2.0

Processor Thermal/Mechanical Information

2.1

Mechanical Requirements

2.1.1

Processor Package

The processor is packaged in a 775-Land LGA package that interfaces with the
motherboard via a LGA775 socket. Refer to the datasheet for detailed mechanical
specifications.
The processor connects to the motherboard through a land grid array (LGA) surface
mount socket. The socket contains 775 contacts arrayed about a cavity in the center of
the socket with solder balls for surface mounting to the motherboard. The socket is
named LGA775 socket. A description of the socket can be found in the LGA775 Socket
Mechanical Design Guide.
The package includes an integrated heat spreader (IHS) that is shown in
Refer to the processor datasheet for more information. In case of conflict, the package
dimensions in the processor datasheet supersedes dimensions provided in this
document.
Figure 1.

Package IHS Load Areas

S u bs tra te S u bs tra te
October 2007
Order Number: 315279 -003US
® TM
Core 2 Duo E6400, E4300, and Intel
To p S u rfa c e o f IHS To p S u rfa c e o f IHS
to in s ta ll a h e a ts in k to in s ta ll a h e a ts in k
® TM
Intel Core 2 Duo E6400, E4300, and Intel
®
Figure
IH S S te p IH S S te p
to in te rfa c e w i th LGA775 to in te rfa c e w i th LGA775
S o c k e t Lo a d P la te S o c k e t Lo a d P la te
® ®
Pentium Dual-Core E2160 Processor
1.
TDG
11