Back Plate Pins - Intel 915GME User Manual

Mobile express chipset development kit
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Figure 7.

Back Plate Pins

4. Clean the die of the processor with isopropyl alcohol before the heat sink is
attached to the processor. This ensures that the surface of the die is clean.
5. Place the heat sink over the pins of the heat sink back plate. Slide the heat sink
over the lugs on the back plate pins so that the base is directly over the processor
die. Turn the heat sink clockwise until it contacts the die. Then turn the heat sink ¼
turn to tighten it. The heat sink should be snug but not tight.
Caution:
Overtightening the heat sink could cause excessive pressure on the die and damage
the processor.
6. Plug the fan connector for the heat sink onto the CPU fan header on the
motherboard.
®
Mobile Intel
915GME Express Chipset
Development Kit User's Manual
52
®
Mobile Intel
915GME Express Chipset —Heat Sink Installation Instructions
Back plate
pins
April 2007
Order Number: 317230-001US

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