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2.0
Getting Started
This chapter identifies the evaluation kit's key components, features and specifications.
It also details basic board setup and operation.
2.1
Overview
The evaluation board consists of a baseboard populated with the Mobile Intel
Express Chipset , other system board components, and peripheral connectors.
Note:
The evaluation board is shipped as an open system allowing for maximum flexibility in
changing hardware configuration and peripherals. Since the board is not in a protective
chassis, take extra precaution when handling and operating the system.
2.1.1
Mobile Intel
Features of the development kit board are summarized below:
Processor
• Supports Intel
the 478 pin Flip Chip Pin Grid Array (Micro-FCPGA) package
— Supported processors are the Intel
Pentium
• Supports Intel
Pin Grid Array (Micro-FCPGA) package
— Supported processors are the Intel
Celeron
Note:
This reference platform does not support the Intel
Mobile Intel
Express GMCH)
• 1257 pin Micro-FCBGA Package
• Supports a 400/533 MHz front side bus
• Dual-Channel DDR2 at 400/533 MHz
• Two SODIMM slots (one per channel) support DDR2 SODIMMS (unbuffered, non-
ECC) modules
• Supports 128 MBytes to 2 GBytes using 256 Mbit, 512 Mbit, or 1 Gbit technology
• x16 PCI Express Graphics or Serial Digital Video Out (SDVO) port
• LVDS, VGA support
I/O Controller Hub 6 (ICH6-M)
• 609 pin plastic BGA package
• DMI (x4) interface with GMCH
®
Mobile Intel
915GME Express Chipset
Development Kit User's Manual
14
®
915GME Express Chipset Features
®
®
Pentium
M Processor with 2 MByte L2 Cache on 90 nm process in
®
M 738 Processor
®
®
Celeron
M Processor on 90 nm process in the 478 pin Flip Chip
®
M 373 Processor
®
915GME Express Graphics Memory Controller Hub (915GME
®
Mobile Intel
915GME Express Chipset —Getting Started
®
®
Pentium
M 760 Processor and the Intel
®
®
Celeron
M 370 Processor and the Intel
®
®
Pentium
®
915GME
®
®
M 745 Processor.
April 2007
Order Number: 317230-001US
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