Intel 915GME User Manual

Mobile express chipset development kit
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Mobile Intel
915GME Express
Chipset
Development Kit User's Manual
April 2007
Order Number: 317230-001US

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Summary of Contents for Intel 915GME

  • Page 1 ® Mobile Intel 915GME Express Chipset Development Kit User’s Manual April 2007 Order Number: 317230-001US...
  • Page 2: Order Number: 317230-001Us

    Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548- 4725, or by visiting Intel’s Web...
  • Page 3: Table Of Contents

    3.4.3.9 LVDS Flat Panel Display Interface... 28 3.4.4 Post Code Debugger ... 28 April 2007 Order Number: 317230-001US ® 915GME Express Chipset Features... 14 ® 915GME Express Chipset ... 22 ® Mobile Intel 915GME Express Chipset Development Kit User’s Manual...
  • Page 4 PCI Express (x1) ...47 4.6.2.5 IDE Connector ...49 4.6.2.6 SATA Pinout ...49 4.6.2.7 Fan Connectors ...50 Heat Sink Installation Instructions ...51 ® Mobile Intel 915GME Express Chipset Development Kit User’s Manual ® Mobile Intel 915GME Express Chipset —Contents Order Number: 317230-001US April 2007...
  • Page 5 Back Panel Connector Locations ... 36 Configuration Jumper and Switch Locations ... 37 ® Mobile Intel 915GME Express Chipset Power On and Reset Buttons ... 40 Heat Sink and Back Plate ... 51 Back Plate Pins ... 52 CPU Fan Header... 53 Tables Acronyms ...
  • Page 6: Revision History

    ® Mobile Intel 915GME Express Chipset —Contents Revision History Date Revision Description April 2007 Initial release of the document ® Mobile Intel 915GME Express Chipset Development Kit User’s Manual April 2007 Order Number: 317230-001US...
  • Page 7: About This Manual

    About This Manual—Mobile Intel 915GME Express Chipset About This Manual This user’s manual describes the use of the Mobile Intel Development Kit. This manual has been written for OEMs, system evaluators, and embedded system developers. This document defines all jumpers, headers, LED functions, and their locations on the board, along with subsystem features and POST codes.
  • Page 8 Development Kit User’s Manual ® Mobile Intel 915GME Express Chipset —About This Manual added to numbers that begin with A through F. (For example, FF is shown as 0FFH.) Decimal and binary numbers are represented by their customary notations. (That is, 255 is a decimal number and 1111 1111 is a binary number.
  • Page 9: Glossary Of Terms And Acronyms

    ® About This Manual—Mobile Intel 915GME Express Chipset Glossary of Terms and Acronyms This section defines conventions and terminology used throughout this document. ADD2 Aggressor AGTL+ Asynchronous GTL+ The processor does not utilize CMOS voltage levels on any Bus Agent...
  • Page 10 Development Kit User’s Manual ® Mobile Intel 915GME Express Chipset —About This Manual needed to ensure the setup time of the receiver. More precisely, flight time is defined as: • The time difference between a signal at the input pin of a receiving agent crossing the switching voltage (adjusted to meet the receiver manufacturer’s conditions required for...
  • Page 11 ® About This Manual—Mobile Intel 915GME Express Chipset System Bus Setup Window Stub Trunk Undershoot (CPU core) Victim VRD 10.0 Table 1 defines the acronyms used throughout this document. Table 1. Acronyms (Sheet 1 of 2) Acronym Anti-Etch April 2007 Order Number: 317230-001US The System Bus is the microprocessor bus of the processor.
  • Page 12: Support Options

    Product documentation is provided online in a variety of web-friendly formats at: http://appzone.intel.com/literature/index.asp 1.4.2 Additional Technical Support If you require additional technical support, please contact your Intel Representative or local distributor. Product Literature You can order product literature from the following Intel literature centers: Table 2.
  • Page 13: Related Documents

    IA-32 Intel Architecture Optimization Reference Manual ® Mobile Intel 915PM/GM/GME/GMS and 910GML/GMLE Express Chipset Datasheet ® Intel 915GM/915GME Express Chipset GMCH Thermal Design Guide for Embedded Applications ® Intel I/O Controller Hub 6 (ICH6) Family Datasheet ® Intel I/O Controller Hub 6 (ICH6) Family Specification Update ®...
  • Page 14: Getting Started

    This chapter identifies the evaluation kit’s key components, features and specifications. It also details basic board setup and operation. Overview The evaluation board consists of a baseboard populated with the Mobile Intel Express Chipset , other system board components, and peripheral connectors. Note: The evaluation board is shipped as an open system allowing for maximum flexibility in changing hardware configuration and peripherals.
  • Page 15 • LVDS connector on top of circuit board near GMCH • One VGA connector provides access to integrated graphics • One LAN connector providing 10/100 connectivity from Intel 82562EZ 10/100 Mbit • One 9-pin serial port connector. • One IrDA port •...
  • Page 16: Included Hardware And Documentation

    Windows* 2000/XP/XP Embedded, Linux*, and others. The AMI* BIOS Application Kit (available through AMI*) includes complete source code, a reference manual, and a Windows-based expert system, BIOStart*, to enable easy and rapid configuration of customized firmware for your Mobile Intel Chipset . ®...
  • Page 17: Before You Begin

    ® Getting Started—Mobile Intel 915GME Express Chipset The following features of AMI* BIOS are enabled in the Mobile Intel Chipset : • DDR2 SDRAM detection, configuration, and initialization ® • Mobile Intel • POST codes displayed to port 80h • PCI/PCI Express device enumeration and configuration •...
  • Page 18: Setting Up The Evaluation Board

    Setting Up the Evaluation Board Once the necessary hardware (described in steps below to set up the Mobile Intel Note: To locate items discussed in the procedure below, please refer to 1. Create a safe work environment.
  • Page 19: Configuring The Bios

    BIOS settings and can be accessed during the Power On Self Test (POST). Setup options are configured through a menu-driven user interface. For AMI BIOS POST codes, visit: http://www.ami.com BIOS updates periodically may be posted to Intel’s Developers’ Web site at: http://developer.intel.com/design/intarch/devkits/ April 2007 Order Number: 317230-001US...
  • Page 20: Theory Of Operation

    Theory of Operation Block Diagram Figure 1 shows the Mobile Intel ® Mobile Intel 915GME Express Chipset Development Kit User’s Manual ® Mobile Intel 915GME Express Chipset —Theory of Operation ® 915GME Express Chipset block diagram. Order Number: 317230-001US April 2007...
  • Page 21: Mechanical Form Factor

    ® Theory of Operation—Mobile Intel 915GME Express Chipset ® Figure 1. Mobile Intel 915GME Express Chipset Block Diagram Thermal Sensor LVDS LVDS/ ALS/BLI PCI Express / SDVO USB 2.0 7 USB Conn 1 Docking Conn 40 Pin Conn SATA Port 2...
  • Page 22: Thermal Management

    — Two 200-pin SODIMM slots — DDR2 400/533 • Direct Media Interface (DMI) • Integrated graphics based on Intel’s Graphics Media Accelerator 900 — Directly supports on-board VGA and LVDS interfaces. — Supports resolutions up to 2048 x 1536 @ 85 Hz.
  • Page 23: Dmi

    Express Graphics. SDVO (ADD2-R) and PCI Express Graphics are multiplexed on the same pins within the Mobile Intel 915GME Express Chipset contains one SDVO/PCI Express Graphics Slot (J6C1) for a PCI Express compatible graphics card or an SDVO compatible graphics card, one LVDS connector (J5F1) and one 15-pin VGA connector (J2A1B).
  • Page 24: On-Board Lan

    3.4.2.3 On-Board LAN The 82562EZ provides the PHY for the Intel ICH6-M’s integrated LAN connect interface. This provides a low cost, reduced footprint solution for 10/100 Mbit LAN connectivity. The 82562EZ component is connected to the ICH6-M chipset through the LAN Connect Interface (LCI) and to an RJ45 connector at J5A1A with built in magnetic decoupling.
  • Page 25: Lpc Super I/O (Sio)/Lpc Slot

    BIOS Firmware Hub (FWH) The 8 Mbit Flash device used on the Mobile Intel system and video BIOS as well as an Intel Random Number Generator (RNG) is a socketed E82802AC8 a 32-pin PLCC package. The reference designator location of the FWH device is U8G1.
  • Page 26: System I/O And Connector Summary

    • Two USB ports via front panel header (J8G1) • One LVDS video connector ® Mobile Intel 915GME Express Chipset Development Kit User’s Manual ® Mobile Intel 915GME Express Chipset —Theory of Operation “Hardware Reference” on page Order Number: 317230-001US April 2007...
  • Page 27: Pci Express Support

    A standard 15 pin D-Sub connector on the rear panel provides access to the analog output of the Intel GMA 900. The integrated graphics supports a maximum resolution of 2048 x 1536 @ 85Hz. This can be connected to any capable analog CRT or flat panel display with analog input.
  • Page 28: Keyboard/Mouse

    Development Kit User’s Manual ® Mobile Intel 915GME Express Chipset —Theory of Operation http://www.ami.com 915GME Express Chipset board uses a CK-410M and CK-SSCD Speed 133 MHz @ 533 100 MHz @ 400 100 MHz @ 400 133 MHz @ 533...
  • Page 29: Transition To S1 Or S3

    Mobile ® Intel 915GME Express Chipset Platform. ® Table 5. Mobile Intel 915GME Express Chipset Power Management States State G0/S0/C0 Full On G0/S0/C2 STPCLK# signal active G0/S0/C3 Deep Sleep: DPSLP# signal active...
  • Page 30: Power Measurement Support

    For AC power loss, the system operation is defined by register settings in the Intel ICH6-M. Upon the return of power, a BIOS option, set prior to the power loss, allows the system to either go immediately to the S5 state, or reboot to the Full-On state, no matter what the state was before the power loss.
  • Page 31 ® Theory of Operation—Mobile Intel 915GME Express Chipset ® Table 6. Mobile Intel 915GME Express Chipset Voltage Rails (Sheet 2 of 4) Voltage Groups 12.0 Switched 2.5 Switched 3.3 Always 3.3 Switched April 2007 Order Number: 317230-001US Reference Voltage Rail Designator +V1.5S_ICH_EV...
  • Page 32: Mobile Intel ® 915Gme Express Chipset Voltage Rails

    ® Table 6. Mobile Intel 915GME Express Chipset Voltage Rails (Sheet 3 of 4) Voltage Groups 5.0 Always 5.0 Switched ® Mobile Intel 915GME Express Chipset Development Kit User’s Manual ® Mobile Intel 915GME Express Chipset —Theory of Operation Reference...
  • Page 33 ® Theory of Operation—Mobile Intel 915GME Express Chipset ® Table 6. Mobile Intel 915GME Express Chipset Voltage Rails (Sheet 4 of 4) Voltage Groups Battery Voltage Batter Voltage Always Battery Voltage Switched Battery Charger April 2007 Order Number: 317230-001US Reference...
  • Page 34: Hardware Reference

    This section provides reference information on the hardware, including locations of evaluation board components, connector pinout information and jumper settings. Figure 2 provides an overview of basic board layout. Primary Features Figure 2 shows the major components of the Mobile Intel board and Table 7 ® Figure 2. Mobile Intel 915GME Express Chipset Component Locations ®...
  • Page 35: 915Gme Express Chipset Component Location Legend

    ® Hardware Reference—Mobile Intel 915GME Express Chipset ® Table 7. Mobile Intel 915GME Express Chipset Component Location Legend Reserved Reserved PCI Express Slot 0 PCI Express Slot 1 Reserved DB400 Clock Buffer PCI Express Slot 2 PCI Slot 4 Port 80...
  • Page 36: Back Panel Connectors

    A fault in the load presented by the external devices could cause damage to the computer, the interconnecting cable, and the external devices themselves. Figure 3 shows the back panel connectors to the Mobile Intel platform. Figure 3. Back Panel Connector Locations...
  • Page 37: Configuration Settings

    The unsupported jumpers must remain in their default position or the operation of the platform is unpredictable. The Mobile Intel board is shipped with the jumpers and switches shunted in the default locations.
  • Page 38: Supported Configuration Jumper/Switch Settings

    ® Mobile Intel 915GME Express Chipset Development Kit User’s Manual ® Mobile Intel 915GME Express Chipset —Hardware Reference Optional Setting Option Setting 1-2 Normal Operation 2-3 to hold the SIO in Reset 1-2 Normal Operation 2-3 to hold the H8 in Reset...
  • Page 39: Unsupported Jumper Default Position

    ® Hardware Reference—Mobile Intel 915GME Express Chipset Table 9. Unsupported Jumper Default Position Jumper Pins J1E2 J1E3 J1F2 J2J2 J3B3 J3C1 J3F1 J3F3 J5G1 J5G2 J6E1 J6E1 J6G2 J7B1 Note: X indicates that the jumper is installed with one contact affixed to pin one and the other contact disconnected.
  • Page 40: Power On And Reset Buttons

    915GME Express Chipset Power On and Reset Buttons ® Mobile Intel 915GME Express Chipset Development Kit User’s Manual ® Mobile Intel 915GME Express Chipset —Hardware Reference 915GME Express Chipset board has two push buttons, POWER and Reset Power Up 4728-01 April 2007 Order Number: 317230-001US...
  • Page 41: Leds

    ® Hardware Reference—Mobile Intel 915GME Express Chipset LEDs The following LEDs provide status for various functions on the Mobile Intel Express Chipset board. ® Table 10. Mobile Intel 915GME Express Chipset LED Function Legend Function Keyboard Number Lock Keyboard Scroll Lock...
  • Page 42: Expansion Slots And Sockets

    DO NOT FORCE CPU into socket. Once the CPU is properly seated ® Mobile Intel 915GME Express Chipset Development Kit User’s Manual ® Mobile Intel 915GME Express Chipset —Hardware Reference Reference Default Stuffing Option Designator Out - normal operation - J9H1 clock enabled...
  • Page 43: Pci Express (X16)

    The slot is wired “lane reversed” which connects the Mobile Intel Express Chipset lanes 0 through 15 to lanes 15 through 0 on the slot. The Mobile Intel 915GME Express Chipset will internally un-reverse this wiring since its CFG9 power-on strap is tied low.
  • Page 44 LANE 12 (R+) LANE 12 (R-) ® Mobile Intel 915GME Express Chipset Development Kit User’s Manual ® Mobile Intel 915GME Express Chipset —Hardware Reference Description RSVD PRSNT2# LANE 4 (T+) LANE 4 (T-) LANE 5 (T+) LANE 5 (T-) LANE 6 (T+)
  • Page 45: Add2 Slot

    SDVO cards provide for a third party vendor secondary graphics add- on such as a digital panel interface. It is important to note that the Mobile Intel 915GME Express Chipset does not support lane reversal of its SDVO interface and since the slot is routed lane reversed, a special SDVO card which un-reverses the lanes must be used.
  • Page 46 End of x4 Connector Reserved SDVOB_Int+ SDVOB_Int- End of x8 Connector Reserved ® Mobile Intel 915GME Express Chipset Development Kit User’s Manual ® Mobile Intel 915GME Express Chipset —Hardware Reference SDVOC_Red+ SDVOC_Red- SDVO_CtrlClk SDVOB_Green+ SDVOB_Green- SDVOB_Blue+ SDVOB_Blue- SDVOB_Clk+ SDVOB_Clk- Reserved SDVOB_CtrlData...
  • Page 47: Pci Express (X1)

    ® Hardware Reference—Mobile Intel 915GME Express Chipset Table 14. ADD2 Slot (J6C1) (Sheet 3 of 3) Number 4.6.2.4 PCI Express (x1) The three PCI Express x1 connectors allow the use of any industry standard PCI Express device. The pin configuration of the connectors is given below.
  • Page 48: Pci Express (X1) Pinout (J7C2, J8C1 & J8D1)

    REFCLK+ REFCLK- LANE 0 (R+) LANE 0 (R-) ® Mobile Intel 915GME Express Chipset Development Kit User’s Manual ® Mobile Intel 915GME Express Chipset —Hardware Reference Description +12 V +12 V RSVD SMCLK SMDAT +3.3 V (JTAG) TRST# +3.3 VAUX...
  • Page 49: Ide Connector

    ® Hardware Reference—Mobile Intel 915GME Express Chipset 4.6.2.5 IDE Connector Table 16. IDE Connector (J7J2) Reset IDE Host Data 7 Host Data 6 Host Data 5 Host Data 4 Host Data 3 Host Data 2 Host Data 1 Host Data 0...
  • Page 50: Fan Connectors

    12, 13, 17, 19 4.6.2.7 Fan Connectors Table 20. Fan Connectors (J3F4 and J3B1) ® Mobile Intel 915GME Express Chipset Development Kit User’s Manual ® Mobile Intel 915GME Express Chipset —Hardware Reference Signal Signal Signal April 2007 Order Number: 317230-001US...
  • Page 51: Heat Sink Installation Instructions

    3. Place the back plate on the underside of the board so that the pins protrude through the holes in the system board around the processor. April 2007 Order Number: 317230-001US ® 915GME Express Chipset ® 915GME Express Chipset to have a thermal Mobile Intel ® 915GME Express Chipset Development Kit User’s Manual...
  • Page 52: Back Plate Pins

    6. Plug the fan connector for the heat sink onto the CPU fan header on the motherboard. ® Mobile Intel 915GME Express Chipset Development Kit User’s Manual ® Mobile Intel 915GME Express Chipset —Heat Sink Installation Instructions Back plate pins April 2007 Order Number: 317230-001US...
  • Page 53: Cpu Fan Header

    ® Heat Sink Installation Instructions—Mobile Intel 915GME Express Chipset Figure 8. CPU Fan Header CPU fan header ® Mobile Intel 915GME Express Chipset April 2007 Development Kit User’s Manual Order Number: 317230-001US...

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