Intel Xeon Processor E5-1600 Datasheet page 4

3.2.4 Execute Disable Bit .................................................................................83
3.3 Intel® Hyper-Threading Technology .....................................................................83
3.4 Intel® Turbo Boost Technology ...........................................................................83
3.4.1 Intel® Turbo Boost Operating Frequency ...................................................83
3.5 Enhanced Intel SpeedStep® Technology ...............................................................84
3.6 Intel® Intelligent Power Technology.....................................................................84
3.7 Intel® Advanced Vector Extensions (Intel® AVX) ..................................................84
3.8 Intel Dynamic Power Technology .........................................................................85
4 Power Management .................................................................................................87
4.1 ACPI States Supported .......................................................................................87
4.1.1 System States........................................................................................87
4.1.2 Processor Package and Core States ...........................................................87
4.1.3 Integrated Memory Controller States .........................................................88
4.1.4 DMI2/PCI Express* Link States.................................................................89
4.1.5 Intel QuickPath Interconnect States ..........................................................89
4.1.6 G, S, and C State Combinations................................................................90
4.2 Processor Core/Package Power Management .........................................................90
4.2.1 Enhanced Intel SpeedStep Technology.......................................................90
4.2.2 Low-Power Idle States.............................................................................91
4.2.3 Requesting Low-Power Idle States ............................................................92
4.2.4 Core C-states .........................................................................................92
4.2.5 Package C-States ...................................................................................94
4.2.6 Package C-State Power Specifications........................................................97
4.3 System Memory Power Management ....................................................................98
4.3.1 CKE Power-Down ....................................................................................98
4.3.2 Self Refresh ...........................................................................................98
4.3.3 DRAM I/O Power Management ..................................................................99
4.4 DMI2/PCI Express* Power Management ................................................................99
5 Thermal Management Specifications ...................................................................... 101
5.1 Package Thermal Specifications ......................................................................... 101
5.1.1 Thermal Specifications........................................................................... 101
5.1.2 TCASE and DTS Based Thermal Specifications........................................... 103
5.1.3 Processor Thermal Profiles ..................................................................... 104
5.1.4 Embedded Server Processor Thermal Profiles............................................ 130
5.1.5 Thermal Metrology ................................................................................ 133
5.2 Processor Core Thermal Features ....................................................................... 135
5.2.1 Processor Temperature.......................................................................... 135
5.2.2 Adaptive Thermal Monitor ...................................................................... 135
5.2.3 On-Demand Mode ................................................................................. 137
5.2.4 PROCHOT_N Signal ............................................................................... 137
5.2.5 THERMTRIP_N Signal ............................................................................ 138
5.2.6 Integrated Memory Controller (IMC) Thermal Features............................... 138
6 Signal Descriptions ................................................................................................ 141
6.1 System Memory Interface Signals ...................................................................... 141
6.2 PCI Express* Based Interface Signals ................................................................. 142
6.3 DMI2/PCI Express* Port 0 Signals ...................................................................... 144
6.4 Intel QuickPath Interconnect Signals .................................................................. 144
6.5 PECI Signal ..................................................................................................... 145
6.6 System Reference Clock Signals ........................................................................ 145
6.7 JTAG and TAP Signals....................................................................................... 145
6.8 Serial VID Interface (SVID) Signals .................................................................... 146
6.9 Processor Asynchronous Sideband and Miscellaneous Signals................................. 146
6.10 Processor Power and Ground Supplies ................................................................ 149
4 Intel® Xeon® Processor E5-1600/ E5-2600/E5-4600 Product Families
Datasheet Volume One