Mechanical Specifications; Boxed Processor Heat Sink Dimensions And Baseboard Keepout Zones; Sts200P And Sts200Pnrw 25.5 Mm Tall Passive Heat Sinks - Intel Xeon Processor E5-1600 Datasheet

Boxed Processor Specifications
sink solutions. The retention solution used for the STS200P Heat Sink Solution is called
the ILM Retention System (ILM-RS).The retention solution used for the STS200PNRW
Narrow Heat Sink Solution is called the Narrow ILM Retention System (Narrow ILM-RS).
Figure 10-3. STS200P and STS200PNRW 25.5 mm Tall Passive Heat Sinks
10.2

Mechanical Specifications

This section documents the mechanical specifications of the boxed processor solution.
10.2.1 Boxed Processor Heat Sink Dimensions and Baseboard
Keepout Zones
The boxed processor and boxed thermal solutions will be sold separately. Clearance is
required around the thermal solution to ensure unimpeded airflow for proper cooling.
Baseboard keepout zones are
and dimensions for the boxed processor and assembled heat sink are shown in
Figure 10-8
connector used for the active fan heat sink solution are represented in
and Figure
None of the heat sink solutions exceed a mass of 550 grams. Note that this is per
processor, a dual processor system will have up to 1100 grams total mass in the heat
sinks. See
Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families
Datasheet Volume One
Figure 10-4
and Figure 10-9. Mechanical drawings for the 4-pin fan header and 4-pin
10-11.
Section 9.6 for details on the processor mass test.
- Figure 10-7. Physical space requirements
Figure 10-10
245