Intel Xeon Processor E5-1600 Datasheet page 128

2. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
3. These specifications are based on final silicon characterization.
4. Power specifications are defined at all VIDs found in
multiple VIDs for each frequency.
5. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Figure 5-23. Tcase: 4-Core 95W Thermal Profile 1U
1. Please refer to
2. Implementation of this Thermal Profile should result in virtually no TCC activation. Refer to the Intel®
Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide for
system and environmental implementation details.
Figure 5-24. DTS: 4-Core 95W Thermal Profile 1U
128
Table 5-23 for discrete points that constitute the thermal profile.
Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families
Thermal Management Specifications
Table 7-3. The processor may be delivered under
.
CASE
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