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Xeon Processor E5-4600
Intel Xeon Processor E5-4600 Manuals
Manuals and User Guides for Intel Xeon Processor E5-4600. We have
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Intel Xeon Processor E5-4600 manual available for free PDF download: Datasheet
Intel Xeon Processor E5-4600 Datasheet (258 pages)
Product Families
Brand:
Intel
| Category:
Computer Hardware
| Size: 2.9 MB
Table of Contents
Table of Contents
3
Revision History
11
1 Overview
13
Introduction
13
Processor Feature Details
14
Intel® Xeon® Processor E5-2600 Product Family on the 2 Socket Platform
14
Supported Technologies
15
Interfaces
15
System Memory Support
15
PCI Express
16
Direct Media Interface Gen 2 (DMI2)
18
Intel® Quickpath Interconnect (Intel® QPI)
18
PCI Express* Lane Partitioning and Direct Media Interface Gen 2 (DMI2)
18
Platform Environment Control Interface (PECI)
19
Power Management Support
19
Processor Package and Core States
19
System States Support
19
Memory Controller
19
System States
19
PCI Express
20
Thermal Management Support
20
Package Summary
20
Terminology
20
Related Documents
23
Referenced Documents
23
State of Data
24
2 Interfaces
25
System Memory Interface
25
System Memory Technology Support
25
System Memory Timing Support
25
PCI Express* Interface
26
PCI Express* Architecture
26
PCI Express* Layering Diagram
26
PCI Express* Configuration Mechanism
27
Packet Flow through the Layers
27
DMI2/PCI Express* Interface
28
DMI2 Error Flow
28
Processor/Pch Compatibility Assumptions
28
DMI2 Link down
28
Intel Quickpath Interconnect
28
Platform Environment Control Interface (PECI)
30
PECI Client Capabilities
30
Rdpkgconfig()
30
Wrpkgconfig()
30
Rdiamsr()
30
Summary of Processor-Specific PECI Commands
30
Client Command Suite
31
Ping() Example
32
Getdib()
32
Device Info Field Definition
33
Revision Number Definition
33
Minor Revision Number Meaning
33
Gettemp()
34
Gettemp() Example
35
Gettemp() Response Definition
35
Rdpkgconfig() Response Definition
36
Wrpkgconfig() Response Definition
37
Rdpkgconfig() & Wrpkgconfig() DRAM Thermal and Power Optimization Services Summary
39
DRAM Thermal Estimation Configuration Data
40
DRAM Rank Temperature Write Data
41
Channel & DIMM Index Decoding
41
The Processor DIMM Temperature Read / Write
42
Ambient Temperature Reference Data
42
Processor DRAM Channel Temperature
43
Accumulated DRAM Energy Data
43
DRAM Power Info Read Data
44
DRAM Power Limit Data
45
DRAM Power Limit Performance Data
45
Rdpkgconfig() & Wrpkgconfig() CPU Thermal and Power Optimization Services Summary
46
CPUID Data
49
Platform ID Data
49
PCU Device ID
49
Maximum Thread ID
50
Processor Microcode Revision
50
Machine Check Status
50
Package Power SKU Unit Data
50
Power Control Register Unit Calculations
51
Package Power SKU Data
52
Package Temperature Read Data
52
Temperature Target Read
53
Thermal Status Word
54
Thermal Averaging Constant Write / Read
54
Current Config Limit Read Data
55
Accumulated Energy Read Data
55
Power Limit Data for VCC Power Plane
56
Package Turbo Power Limit Data
57
Package Power Limit Performance Data
57
Efficient Performance Indicator Read
58
ACPI P-T Notify Data
58
Caching Agent TOR Read Data
59
Thermal Margin Read
59
Rdiamsr() Response Definition
62
Rdiamsr() Services Summary
62
PCI Configuration Address
64
Rdpciconfig()
64
PCI Configuration Address for Local Accesses
65
Rdpciconfig() Response Definition
65
Rdpciconfiglocal() Response Definition
66
Wrpciconfiglocal() Response Definition
68
Client Management
69
Wrpciconfiglocal() Memory Controller and IIO Device/Function Support
69
PECI Client Response During Power-Up
69
The Processor PECI Power-Up Timeline()
70
SOCKET ID Strapping
71
Power Impact of PECI Commands Vs. C-States
71
Multi-Domain Commands
74
Domain ID Definition
74
Multi-Domain Command Code Reference
74
Client Responses
75
Completion Code Pass/Fail Mask
75
Device Specific Completion Code (CC) Definition
75
Originator Responses
76
DTS Temperature Data
76
Temperature Sensor Data Format
76
Originator Response Guidelines
76
3 Technologies
79
Intel® Virtualization Technology (Intel® VT)
79
Intel VT-X Objectives
79
Intel VT-X Features
80
Intel VT-D Objectives
80
Intel Virtualization Technology Processor Extensions
81
Security Technologies
81
Intel® Trusted Execution Technology
81
Intel Trusted Execution Technology - Server Extensions
82
Intel® Advanced Encryption Standard Instructions (Intel® AES-NI)
82
Execute Disable Bit
83
Intel® Hyper-Threading Technology
83
Intel® Turbo Boost Technology
83
Intel® Turbo Boost Operating Frequency
83
Enhanced Intel Speedstep® Technology
84
Intel® Intelligent Power Technology
84
Intel® Advanced Vector Extensions (Intel® AVX)
84
Intel Dynamic Power Technology
85
4 Power Management
87
ACPI States Supported
87
System States
87
Processor Package and Core States
87
Package C-State Support
87
Integrated Memory Controller States
88
Core C-State Support
88
System Memory Power States
88
DMI2/PCI Express Link States
89
Intel Quickpath Interconnect States
89
G, S, and C State Combinations
89
G, S and C State Combinations
89
Intel QPI States
89
Processor Core/Package Power Management
90
Enhanced Intel Speedstep Technology
90
Low-Power Idle States
90
Requesting Low-Power Idle States
91
Idle Power Management Breakdown of the Processor Cores
91
Thread and Core C-State Entry and Exit
91
Core C-States
92
P_Lvlx to MWAIT Conversion
92
Package C-States
94
Package C-State Entry and Exit
95
Coordination of Core Power States at the Package Level
95
Package C-State Power Specifications
97
System Memory Power Management
97
CKE Power-Down
98
Self Refresh
98
DRAM I/O Power Management
99
DMI2/PCI Express* Power Management
99
5 Thermal Management Specifications
101
Package Thermal Specifications
101
Thermal Specifications
101
TCASE and DTS Based Thermal Specifications
102
Processor Thermal Profiles
104
Processor SKU Summary Table
104
Tcase: 8-Core 150W Thermal Specifications, Workstation Platform SKU Only
104
Tcase: 8-Core 150W Thermal Profile, Workstation Platform SKU Only
105
DTS: 8-Core 150W Thermal Profile, Workstation Platform SKU Only
105
8-Core 150W Thermal Profile, Workstation Platform SKU Only
106
Tcase: 8-Core 135W Thermal Profile 2U
107
Tcase: 8-Core 135W Thermal Specifications 2U
107
DTS: 8-Core 135W Thermal Profile 2U
108
8-Core 135W Thermal Profile Table 2U
108
Tcase: 8/6-Core 130W Thermal Specifications, Workstation/Server Platform
109
Tcase: 8/6-Core 130W Thermal Profile 1U
110
DTS: 8-Core 130W Thermal Profile 1U
110
DTS: 6-Core 130W Thermal Profile 1U
111
Core 130W Thermal Profile Table 1U
111
Tcase: 6-Core 130W 1S WS Thermal Profile
112
Tcase: 6-Core 130W 1S WS Thermal Specifications
112
DTS: 6-Core 130W 1S WS Thermal Profile
113
Tcase: 8-Core 115W Thermal Specifications 1U
114
Tcase: 8-Core 115W Thermal Profile 1U
115
DTS: 8-Core 115W Thermal Profile 1U
115
Core 115W Thermal Profile Table 1U
116
Tcase: 8/6-Core 95W Thermal Specifications, Workstation/Server Platform
116
Tcase: 8/6-Core 95W Thermal Profile 1U
117
DTS: 8-Core 95W Thermal Profile 1U
117
DTS: 6-Core 95W Thermal Profile 1U
118
Core 95W Thermal Profile Table 1U
118
Tcase: 8-Core 70W Thermal Profile 1U
119
Tcase: 8-Core 70W Thermal Specifications 1U
119
DTS: 8-Core 70W Thermal Profile 1U
120
Core 70W Thermal Profile Table 1U
120
Tcase: 6-Core 60W Thermal Profile 1U
121
Tcase: 6-Core 60W Thermal Specifications 1U
121
DTS: 6-Core 60W Thermal Profile 1U
122
Core 60W Thermal Profile Table 1U
122
Tcase: 4-Core 130W Thermal Profile 2U
123
Tcase: 4-Core 130W Thermal Specifications 2U
123
DTS: 4-Core 130W Thermal Profile 2U
124
Core 130W Thermal Profile Table 2U
124
Tcase: 4-Core 130W 1S WS Thermal Specifications, Workstation/Server Platform
125
Tcase: 4-Core 130W 1S WS Thermal Profile
126
DTS: 4-Core 130W 1S WS Thermal Profile
126
Tcase: 4/2-Core 80W Thermal Specifications 1U
129
Tcase: 4/2-Core 80W Thermal Profile 1U
130
DTS: 4-Core 80W Thermal Profile 1U
130
DTS: 2-Core 80W Thermal Profile 1U
131
Core 80W Thermal Profile Table 1U
131
Embedded Server Processor Thermal Profiles
132
Embedded Server Processor Elevated Tcase SKU Summary Table
132
Tcase: 8-Core LV95W Thermal Specifications, Embedded Server SKU
132
Tcase: 8-Core LV95W Thermal Profile, Embedded Server SKU
133
Tcase: 8-Core LV70W Thermal Profile, Embedded Server SKU
135
Tcase: 8-Core LV70W Thermal Specifications, Embedded Server SKU
135
Core LV70W Thermal Profile Table, Embedded Server SKU
136
Thermal Metrology
137
Processor Core Thermal Features
138
Processor Temperature
138
Adaptive Thermal Monitor
138
Frequency and Voltage Ordering
139
On-Demand Mode
140
PROCHOT_N Signal
140
THERMTRIP_N Signal
141
Integrated Memory Controller (IMC) Thermal Features
141
6 Signal Descriptions
143
System Memory Interface Signals
143
Memory Channel DDR0, DDR1, DDR2, DDR3
143
PCI Express* Based Interface Signals
144
Memory Channel Miscellaneous
144
PCI Express* Port 1 Signals
144
PCI Express* Port 2 Signals
144
PCI Express* Port 3 Signals
145
PCI Express* Miscellaneous Signals
145
DMI2/PCI Express* Port 0 Signals
146
Intel Quickpath Interconnect Signals
146
DMI2 and PCI Express* Port 0 Signals
146
Intel QPI Port 0 and 1 Signals
146
Intel QPI Miscellaneous Signals
146
PECI Signal
147
System Reference Clock Signals
147
JTAG and TAP Signals
147
PECI Signals
147
System Reference Clock (BCLK{0/1}) Signals
147
Serial VID Interface (SVID) Signals
148
Processor Asynchronous Sideband and Miscellaneous Signals
148
SVID Signals
148
Processor Asynchronous Sideband Signals
148
Miscellaneous Signals
148
Processor Power and Ground Supplies
150
Power and Ground Signals
150
7 Electrical Specifications
153
Processor Signaling
153
System Memory Interface Signal Groups
153
PCI Express* Signals
153
DMI2/PCI Express* Signals
153
Intel Quickpath Interconnect (Intel QPI)
153
Platform Environmental Control Interface (PECI)
154
System Reference Clocks (BCLK{0/1}_DP, BCLK{0/1}_DN)
154
Input Device Hysteresis
154
JTAG and Test Access Port (TAP) Signals
155
Processor Sideband Signals
155
Power, Ground and Sense Signals
155
Power and Ground Lands
155
Decoupling Guidelines
156
VR Power-State Transitions
158
SVID Address Usage
159
VR12.0 Reference Code Voltage Identification (VID) Table
159
Reserved or Unused Signals
160
Signal Group Summary
160
Signal Description Buffer Types
160
Signal Groups
160
Power-On Configuration (POC) Options
164
Signals with On-Die Termination
164
Power-On Configuration Option Lands
164
Fault Resilient Booting (FRB)
165
Mixing Processors
165
Fault Resilient Booting (Output Tri-State) Signals
165
Flexible Motherboard Guidelines (FMB)
166
Absolute Maximum and Minimum Ratings
166
Processor Absolute Minimum and Maximum Ratings
166
Storage Conditions Specifications
167
Storage Condition Ratings
167
DC Specifications
168
Voltage and Current Specifications
169
Voltage Specification
169
Processor Current Specifications
170
Die Voltage Validation
175
Load Current Versus Time
175
VCC Overshoot Specifications
175
Signal DC Specifications
176
VCC Overshoot Example Waveform
176
Waveforms
176
DDR3 and DDR3L Signal DC Specifications
176
PECI DC Specifications
178
System Reference Clock (BCLK{0/1}) DC Specifications
178
Smbus DC Specifications
178
JTAG and TAP Signals DC Specifications
179
Serial VID Interface (SVID) DC Specifications
179
Processor Asynchronous Sideband DC Specifications
180
Miscellaneous Signals DC Specifications
181
BCLK{0/1} Differential Clock Crosspoint Specification
182
BCLK{0/1} Differential Clock Measurement Point for Ringback
182
BCLK{0/1} Single Ended Clock Measurement Points for Absolute Cross Point and Swing
182
Signal Quality
183
DDR3 Signal Quality Specifications
183
I/O Signal Quality Specifications
183
BCLK{0/1} Single Ended Clock Measurement Points for Delta Cross Point
183
Intel Quickpath Interconnect Signal Quality Specifications
184
Input Reference Clock Signal Quality Specifications
184
Overshoot/Undershoot Tolerance
184
Processor I/O Overshoot/Undershoot Specifications
184
Activity Factor
185
Maximum Acceptable Overshoot/Undershoot Waveform
186
Processor Sideband Signal Group Overshoot/Undershoot Tolerance
186
8 Processor Land Listing
187
Listing by Land Name
187
Land Name
187
Listing by Land Number
212
Land Number
212
9 Package Mechanical Specifications
237
Package Mechanical Drawing
237
Processor Package Assembly Sketch
237
Processor Package Drawing Sheet 1 of 2
239
Processor Package Drawing Sheet 2 of 2
240
Processor Component Keep-Out Zones
241
Package Loading Specifications
241
Package Handling Guidelines
241
Package Insertion Specifications
241
Processor Loading Specifications
241
Processor Mass Specification
242
Processor Materials
242
Processor Markings
242
Processor Top-Side Markings
242
10 Boxed Processor Specifications
243
Introduction
243
Available Boxed Thermal Solution Configurations
243
Intel Thermal Solution STS200C (Passive/Active Combination Heat Sink Solution)
243
Intel Thermal Solution STS200P and STS200PNRW (Boxed 25.5 MM Tall Passive Heat Sink Solutions)
244
STS200C Passive/Active Combination Heat Sink (with Removable Fan)
244
STS200C Passive/Active Combination Heat Sink (with Fan Removed)
244
Mechanical Specifications
245
Boxed Processor Heat Sink Dimensions and Baseboard Keepout Zones
245
STS200P and STS200PNRW 25.5 MM Tall Passive Heat Sinks
245
Boxed Processor Motherboard Keepout Zones (1 of 4)
246
Boxed Processor Motherboard Keepout Zones (2 of 4)
247
Boxed Processor Motherboard Keepout Zones (3 of 4)
248
Boxed Processor Motherboard Keepout Zones (4 of 4)
249
Boxed Processor Heat Sink Volumetric (1 of 2)
250
Boxed Processor Heat Sink Volumetric (2 of 2)
251
Boxed Processor Retention Mechanism and Heat Sink Support (ILM-RS)
254
Fan Power Supply [STS200C]
254
PWM Fan Frequency Specifications for 4-Pin Active Thermal Solution
254
Boxed Processor Cooling Requirements
255
Boxed Processor Contents
256
Core / 6 Core Server Thermal Solution Boundary Conditions
256
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