Table Of Contents - Intel BX80570E8200 - Core 2 Duo 2.66 GHz Processor Design Manual

Contents
1 Introduction ...................................................................................................11
1.1 Document Goals and Scope ...................................................................11
1.1.1
1.1.2
1.1.3
1.2 References ..........................................................................................13
1.3 Definition of Terms ...............................................................................13
2 Processor Thermal/Mechanical Information .........................................................15
2.1 Mechanical Requirements ......................................................................15
2.1.1
2.1.2
2.2 Thermal Requirements ..........................................................................18
2.2.1
2.2.2
2.2.3
2.2.4
2.3 Heatsink Design Considerations ..............................................................21
2.3.1
2.3.2
2.3.3
2.3.4
2.4 System Thermal Solution Considerations .................................................24
2.4.1
2.4.2
2.4.3
2.5 System Integration Considerations..........................................................25
3 Thermal Metrology ..........................................................................................27
3.1 Characterizing Cooling Performance Requirements ....................................27
3.1.1
3.2 Processor Thermal Solution Performance Assessment ................................29
3.3 Local Ambient Temperature Measurement Guidelines.................................29
3.4 Processor Case Temperature Measurement Guidelines ...............................32
4 Thermal Management Logic and Thermal Monitor Feature .....................................33
4.1 Processor Power Dissipation ...................................................................33
4.2 Thermal Monitor Implementation ............................................................33
4.2.1
4.2.2
4.2.3
4.2.4
Thermal and Mechanical Design Guidelines
Importance of Thermal Management ..........................................11
Document Goals......................................................................11
Document Scope .....................................................................12
Processor Package...................................................................15
Heatsink Attach ......................................................................17
2.1.2.1 General Guidelines ....................................................17
2.1.2.2 Heatsink Clip Load Requirement..................................17
2.1.2.3 Additional Guidelines .................................................18
Processor Case Temperature .....................................................18
Thermal Profile .......................................................................19
Thermal Solution Design Requirements ......................................19
T ..................................................................................20
CONTROL
Heatsink Size..........................................................................22
Heatsink Mass.........................................................................22
Package IHS Flatness...............................................................23
Thermal Interface Material........................................................23
Chassis Thermal Design Capabilities...........................................24
Improving Chassis Thermal Performance ....................................24
Summary ...............................................................................25
Example ................................................................................28
PROCHOT# Signal ...................................................................34
Thermal Control Circuit ............................................................34
4.2.2.1 Thermal Monitor .......................................................34
Thermal Monitor 2 ...................................................................35
Operation and Configuration .....................................................36
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