Asus P7P55D-E DELUXE User Manual page 38

P7P55D-E Deluxe Motherboard Qualified Vendors Lists (QVL) DDR3-1333MHz
capability for CPU at 2.66GHz, 2.8GHz and 2.93GHz (continued)
Vendor Part No.
SAMSUNG M378B2873DZ1-CH9
SAMSUNG M378B2873EH1-CH9
SAMSUNG M391B2873DZ1-CH9
SAMSUNG M378B5673DZ1-CH9
SAMSUNG M378B5673EH1-CH9
SAMSUNG M391B5673DZ1-CH9
SAMSUNG M378B5273BH1-CH9
Super Talent W1333UX2GB(XMP)
Transcend TS128MLK64V3U
Transcend TS256MLK64V3U
Asint SLY3128M8-EDJ
Asint SLY3128M8-EDJE
Asint SLZ3128M8-EDJ
Asint SLZ3128M8-EDJE
ASUS N/A
BUFFALO FSX1333D3G-1G
BUFFALO FSH1333D3G-T3G(XMP) 3GB(3x1GB) SS N/A
BUFFALO FSX1333D3G-2G
Elixir M2Y2G64CB8HA9N-CG
Patriot PDC32G1333LLK
Patriot PVT33G1333ELK
Patriot PVS34G1333ELK
Patriot PVS34G1333LLK
Patriot PVT36G1333ELK
Silicon
SP001GBLTU133S02
Power
Silicon
SP002GBLTU133S02
Power
P7P55D-E Deluxe Motherboard Qualified Vendors Lists (QVL) DDR3-1067MHz
capability for CPU at 2.66GHz, 2.8GHz and 2.93GHz
Vendor Part No.
CORSAIR CM3X1024-1066C7
Crucial CT12864BA1067.8FF
Crucial CT12864BA1067.8SFD
Crucial CT12872BA1067.9FF
Crucial CT25664BA1067.16FF
Crucial CT25664BA1067.16SFD
Crucial CT25672BA1067.18FF
ELPIDA EBJ10UE8BAW0-AE-E
ELPIDA EBJ11RD8BAFA-AE-E
ELPIDA EBJ11UD8BAFA-AG-E
ELPIDA EBJ21UE8BAW0-AE-E
Hynix HMT112U6AFP8C-G7N0
Hynix HYMT112U64ZNF8-G7
Hynix HMT125U6AFP8C-G7N0
Hynix HYMT125U64ZNF8-G7
KINGSTON KVR1066D3N7/1G
KINGSTON KVR1066D3N7/2G
KINGSTON KVR1066D3N7/4G
MICRON MT8JTF12864AY-1G1D1
MICRON MT8JTF12864AZ-1G1F1
MICRON MT8JTF12864AZ-1G1F1
2-18
SS/ Chip
Size Chip NO.
DS Brand
1GB SS SAMSUNG K4B1G0846D
1GB SS SAMSUNG K4B1G0846E
1GB SS SAMSUNG K4B1G0846D(ECC) 9(1333-9-9-9-24)
2GB DS SAMSUNG K4B1G0846D
2GB DS SAMSUNG K4B1G0846E
2GB DS SAMSUNG K4B1G0846D(ECC) 9(1333-9-9-9-24)
4GB DS SAMSUNG K4B2G0846B-HCH9 9(1333-9-9-9-24)
2GB(2x1GB) SS N/A Heat-Sink Package
1GB SS SAMSUNG K4B1G0846D
2GB DS SAMSUNG K4B1G0846D
1GB SS Asint DDRIII1208-DJ
1GB SS ELPIDA J1108BASE-DJ-E
2GB DS Asint DDRIII1208-DJ
2GB DS ELPIDA J1108BASE-DJ-E
1GB DS N/A Heat-Sink Package
1GB SS N/A Heat-Sink Package
Heat-Sink Package
2GB DS N/A Heat-Sink Package
2GB DS N/A Heat-Sink Package
1GB SS PATRIOT Heat-Sink Package
3GB(3x1GB) SS N/A Heat-Sink Package
4GB(2x2GB) DS N/A Heat-Sink Package
4GB(2x2GB) DS N/A Heat-Sink Package
6GB(3x2GB) DS N/A Heat-Sink Package
1GB SS S-POWER I0YT3E0
2GB DS S-POWER I0YT3E0
SS/
Size Chip Brand Chip NO.
DS
1GB DS N/A Heat-Sink Package
1GB SS MICRON D9KPT
1GB SS MICRON D9JNL
1GB SS MICRON D9KPT(ECC)
2GB DS MICRON D9KPT
2GB DS MICRON D9JNL
2GB DS MICRON D9KPT(ECC)
1GB SS ELPIDA J1108BABG-DJ-E
1GB DS ELPIDA J5308BASE-AC-E(ECC) 7
1GB DS ELPIDA J5308BASE-AC-E
2GB DS ELPIDA J1108BABG-DJ-E
1GB SS HYNIX H5TQ1G83AFPG7C
1GB SS HYNIX HY5TQ1G831ZNFP-G7 7
2GB DS HYNIX H5TQ1G83AFPG7C
2GB DS HYNIX HY5TQ1G831ZNFP-G7 7
1GB SS ELPIDA J1108BABG-DJ-E
2GB DS ELPIDA J1108BABG-DJ-E
4GB DS SAMSUNG K4B2G0846B-HCF8
1GB SS MICRON 7VD22
1GB SS MICRON 8ZF22 D9KPV
1GB SS MICRON D9KPT
Timing
Voltage
Dimm(Bios)
9(1333-9-9-9-24) N/A
(1066-8-7-7-20) N/A
N/A
9(1333-9-9-9-24) N/A
(1066-8-7-7-20) N/A
N/A
N/A
8(1333-8-8-8-24) 1.8
9(1333-9-9-9-24) N/A
9(1333-9-9-9-24) N/A
(9-9-9-24) N/A
(1066-8-8-8-20) N/A
(9-9-9-24) N/A
(1066-8-8-8-20) N/A
(1333-9-9-9-24) N/A
(1066-7-7-7-20) N/A
7-7-7-20(1066-8-7-7-20) N/A
(1066-7-7-7-20) N/A
(1333-7-7-7-20) N/A
7(1337-7-7-7-20) 1.7
9-9-9-24(1066-7-7-7-20) 1.65
9-9-9-24(1066-7-7-7-20) 1.5
7-7-7-20(1066-7-7-7-20) 1.7
9-9-9-24(1066-7-7-7-20) 1.65
9(1333-9-9-9-24) N/A
9(1333-9-9-9-24) N/A
DIMM socket support
Timing
(Optional)
Voltage
Dimm(Bios)
A* B*
7 1.1 • •
7(1066-7-7-7-20) N/A • •
7 N/A • •
7(1066-9-9-9-25) N/A • •
7(1066-7-7-7-20) N/A • •
7 N/A • •
7(1066-7-7-7-20) N/A • •
7(1066-7-7-7-20) N/A • •
N/A • •
8 N/A • •
7(1066-7-7-7-20) N/A • •
7 N/A • •
N/A •
7 N/A • •
N/A • •
(1066-7-7-7-20) 1.5 • •
(1066-7-7-7-20) 1.5 • •
(1066-7-7-7-20) 1.5 • •
7 N/A • •
7(1066-7-7-7-20) N/A • •
7(1066-7-7-7-20) N/A • •
Chapter 2: Hardware information
DIMM socket
support
(Optional)
A* B* C*
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C*
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