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CORE 2 DUO MOBILE - THERMAL DESIGN GUIDE...
Design manual
Intel CORE 2 DUO MOBILE - THERMAL DESIGN GUIDE 6-2008 Design Manual page 36
Processors on 45-nm process for embedded applications
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Mechanical Drawings—Core™ 2 Duo Mobile Processors
Figure 20.
CompactPCI* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 2
of 2)
June 2008
Order Number: 320028-001
Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications
TDG
36
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