Thermal Solution Component Suppliers; Reference Heatsink - Intel CORE 2 DUO MOBILE - THERMAL DESIGN GUIDE 6-2008 Design Manual

Processors on 45-nm process for embedded applications
Table of Contents

Advertisement

Appendix A Thermal Solution Component Suppliers
These vendors and devices are listed by Intel as a convenience to Intel's general customer base. Intel
does not make any representations or warranties whatsoever regarding quality, reliability,
functionality, or compatibility of these devices. This list and/or these devices may be subject to
change without notice.
Note:
The enabled components may not be currently available from all suppliers. Contact the
supplier directly to verify availability.
Table 5.

Reference Heatsink

AdvancedTCA* passive heatsink assembly
1U+ passive heatsink assembly
cPCI passive heatsink assembly
Thermal Interface Material
Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide
TDG
29
Core™ 2 Duo Mobile Processors—Thermal Solution Component Suppliers
Part
ECC-00177-01-GP
ECC-00179-01-GP
ECC-00178-01-GP
PCM45F
Part Number
Contact Information
Cooler Master*
Wendy Lin
wendy@coolermaster.com
(510)770-8566 ext 211
Honeywell*
Paula Knoll
paula.knoll@honeywell.com
(858) 279-2956
Order Number: 320028-001
June 2008

Advertisement

Table of Contents
loading

This manual is also suitable for:

Core 2 duo mobile

Table of Contents