Keep Out Zone Requirements; Thermal Performance; 1U Reference Heatsink Assembly - Intel CORE 2 DUO MOBILE - THERMAL DESIGN GUIDE 6-2008 Design Manual

Reference Thermal Solutions—Core™ 2 Duo Mobile Processors
Figure 8.

1U Reference Heatsink Assembly

6.4.1

Keep Out Zone Requirements

The keep out zone requirements on the PCB to use this heatsink are detailed in
"Mechanical Drawings". Because it extends beyond the footprint of the device, it is critical for board
designers to allocate space for the heatsink.
6.4.2

Thermal Performance

The 1U reference heatsink employs a thick copper (C1100) base with aluminum (Al 1050) stamped
fins, soldered to the base. The heatsink has been tested at flow rates from 10 CFM to 25 CFM. For a
40 °C external ambient and 35 W TDP, the heatsink is expected to meet the thermal performance
needed when the air flow rate is greater than 10 CFM. If the external ambient is 55 °C, this heatsink
will be suitable if the air flow rate is approximately 12 CFM or greater.
June 2008
Order Number: 320028-001
Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications
Appendix B,
TDG
20