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Figure 7-40. ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components - Sheet 1
D
47.50
45.26
39.01
36.78
31.96
31.51
28.00
C
21.00
20.00
SOCKET VOL
OUTLINE
13.00
7.05
2.20
2 0.00
6.15
(
16.00
)
SEE DETAIL A
24.51
(
20.00
)
36.00
36.78
41.00
45.26
47.50
(
19.13
)
A
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2 GEOMETRIC CENTER OF CPU PACKAGE / SOCKET HOUSING CAVITY.
3. BOARD COMPONENET KEEP-INS AND MECHANICAL COMPONENET KEEP-OUTS
TO BE UTILIZED WITH SUFFICIENT ALLOWANCES FOR PLACEMENT AND SIZE TOLERANCES,
ASSEMBLY PROCESS ACCESS, AND DYNAMIC EXCURSIONS.
4. ASSUME SYMMETRY FOR UNDIMENSIONED CORNERS AND EDGES.
8
7
110
(
95.00
)
BOARD PRIMARY SIDE
(
72.00
)
(
37.50
)
36.00
31.51
23.00
19.32
15.50
(
37.50
)
(
72.00
15.50
19.32
23.00
31.51
36.00
39.01
4X
6.00
SOCKET BALL 1
4X
4.03
PACKAGE
BOUNDARY
6
5
ZONE
REV
(
1.93
)
(
1.09
SOCKET BALL 1
(
16.965
)
(
1.17
)
PIN 1
PIN 1
PACKAGE LANDS
(
1.09
(
17.44
(
95.00
)
DETAIL A
)
LEGEND
SOCKET/THERMO/MECHANICAL COMPONENT KEEP-INS
10.0 MM MAX COMPONENT HEIGHT
2.5 MM MAX COMPONENT HEIGHT
6.0 MM MAX COMPONENT HEIGHT
25.0 MM MAX COMPONENT HEIGHT
1.8 MM MAX COMPONENT HEIGHT
BOARD ROUTING KEEP-OUT
UNLESS OTHERWISE SPECIFIED
DESIGNED BY
DATE
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5M-1994
DIMENSIONS ARE IN MILLIMETERS
CHECKED BY
DATE
APPROVED BY
DATE
THIRD ANGLE PROJECTION
APPROVED BY
DATE
MATERIAL:
N/A
FINISH:
N/A
4
3
Thermal and Mechanical Design Guidelines
Mechanical Drawings
REVISION HISTORY
DESCRIPTION
DATE
APPROVED
)
D
SOCKET BALLS
(
1.17
)
(
0.965
)
(
2.80
)
PACKAGE BOUNDARY
C
(
0.570
)
SOCKET HOUSING
)
CAVITY
)
B
DEPARTMENT
R
A
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
CORP.
SANTA CLARA, CA 95052-8119
TITLE
LGA775 microATX
COMPONENT KEEP-INS
SIZE
CAGE CODE
DRAWING NUMBER
REV
C40819
D
3
SCALE: NONE
DO NOT SCALE DRAWING
SHEET 1 OF 3
2
1
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