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R
Figure 7-8. Example of Dimensioning for Thermocouple Groove
Note: Dimensions are in inches. Centerlines in drawing correspond to the thermocouple location (geometric
center of IHS).
7.4.2.
About the High Power Application
The High Power Application software (a.k.a. "HIPWR30.EXE" or "HIPWRMP2.EXE") is intended for
thermal evaluation purposes only. This software is not a general-purpose application. The software may
not generate the absolute worst-case thermal power dissipation as defined in the processor datasheets.
Differences between the observed thermal power measurements and the maximum power dissipation
indicated in the datasheets can be attributed to processor manufacturing process variation, system voltage
regulation configuration differences, and potential High Power Application software optimizations. This
software does provide system designers with an application that will power a processor to very near the
TDP identified in the processor datasheets and is intended to be a tool for the analysis and validation of
system cooling solutions.
All systems should be designed with the ability to dissipate the thermal design power (TDP) indicated in
the datasheets. The High Power Application software, utilizing the methodologies presented in this
document, can enable system designers to design and validate robust cooling solutions that can
adequately cool the processor at the maximum specifications.
The High Power Application software maximizes the current consumption of the processor core. All
execution stages and various functional units of the core and L1 cache are fully utilized. The software
performs minimal system bus accesses, with minimal L2 cache utilization. This mode of operation
produces a large amount of thermal power from the processor.
Contact your Intel Field Sales representative to obtain a copy of the software.
7.4.3.
Executing the High Power Application Software
The High Power Application software is a 32 bit Windows NT* or Windows* 95/98 application. The
application should be executed from a DOS window command prompt from within the Windows NT or
249660-001
®
®
Intel
Pentium
III Processor in the FC-PGA2 Package Thermal Design Guidelines
31
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