Power Simulation Software; Figure 6. Thermal Solution Decision Flowchart - Intel E7500 Thermal Design Manual

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Power Simulation Software

The power simulation software is a utility designed to dissipate the thermal design power on an
E7500/E7505 chipset MCH when used in conjunction with Intel
L2 cache. The combination of the Xeon processor(s) with 512-KB L2 cache and the higher
bandwidth capability of the E7500/E7505 chipsets enable new levels of system performance. To
assess the thermal performance of the chipset MCH thermal solution under "worst-case realistic
application" conditions, Intel has developed a software utility that operates the chipset at near
worst-case power dissipation.
The utility has been developed solely for testing customer thermal solutions at near the thermal
design power. Figure 6 shows a decision flowchart for determining thermal solution needs. Real
future applications may exceed the thermal design power limit for transient time periods. For
power supply current requirements under these transient conditions, refer to each component's
datasheet for the I
representative to obtain a copy of this software.

Figure 6. Thermal Solution Decision Flowchart

Attach device to
board using
normal reflow
process
®
Intel E7500/E7505 Chipset MCH Thermal Design Guide
(Max Power Supply Current) specification. Contact your Intel Field Sales
CC
Start
Attach thermocouples
using recommended
methodology. Setup
the system in the
desired configuation.
Select
heatsink
®
Xeon™ processor with 512-KB
Run the power
program and
Tdie >
monitor the
Specification?
device die
temperature.
Yes
Heatsink
requied
Thermal Metrology
No
End
Therm_Flowchart
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