Mechanical Parts Rework Procedures - Motorola iDEN i930 Field Service Manual

7. Lower the nozzle over shield and evenly apply heat until reflow of all solder joints is observed.
(Approximately 180 Seconds)
8. Immediately remove shield from board before solder joints re-solidifies by grabbing it from the
two exposed holes using a bent tip tweezers, and being careful not to bump any component
underneath it.
9. Release shield onto a heat resistant surface, remove the heat-protector from shield and discard
cut shield to a safe container
10. Check for component disturbance before proceed and fix it if necessary
9.8.3 Component Rework
As usual (Do not overheat)
9.8.4 Shield Installation Procedure
Preparation: Place adequate Nozzle in the hand-piece of the Hot Air Machine. Set desired air
Do not utilize pre-heater acceleration if "X-kar X-1001s" equipment is being
NOTE:
used.
1. Get shield ready by placing heat-protector on top of it, and place complete set over a thin film of
flux on block.
2. Protect any heat-sensitive component by placing appropriate Heat Shield over (If necessary)
3. Carefully place fluxed 'shield/heat-protector set' over the lands as per overlay or Pedro
4. Lower the nozzle and evenly apply heat until solder reflow is observed.
5. Align the shield if necessary.
6. Observe until re-flow is completed (Approximately 150 Seconds)
7. Raise nozzle and stop heat cycle.
8. Allow solder to re-solidify before you remove the heat-protector from the top of the shield.
9. Cool off the PC board using bench fan.
10. Remove heat-protector
11. Inspect solder joints and adjacent components under Microscope.
9.9 Mechanical Parts Rework Procedure
9.9.1 Removal Procedure
68P80401P03-O
MECHANICAL PARTS REWORK AND REPAIR: Mechanical Parts Rework Procedure
pressure. Set Temperature: Top 330°C – Bottom 100°C
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