Bga Rework/Repair Procedure - Motorola iDEN i930 Field Service Manual

MECHANICAL PARTS REWORK AND REPAIR: BGA Rework/Repair Procedure
U204 (Half Life)
See section LGA Rework/Repair ProcedureLGA Rework/Repair Procedure
Top 330ºC - Bottom 100ºC
OK Industries20 l/min
Pace
²Alignment must be checked on all four sides of the component to avoid misplacement.
U1400 (GPS)
See section LGA Rework/Repair ProcedureLGA Rework/Repair Procedure
Top 330ºC - Bottom 100ºC
OK Industries20 l/min
Pace 8/9
²Alignment must be checked on all four sides of the component to avoid misplacement.
M751 (Microphone)
See Section Mechanical Parts Rework ProcedureMechanical Parts Rework Procedure
Top 330ºC - Bottom 100ºC
OK Industries15 l/min
Pace
9.7

BGA Rework/Repair Procedure

9.7.1 Component Removal Procedure
1. Set proper temperatures.
2. With bottom heater ON, place the assembly on top of it to start pre-heating the PCB.
3. Place adequate Nozzle in the hand-piece of the Hot Air Machine.
4. Set desired air pressure.
9-8
8/9
6/7
²Do not reflow this component without Heat protection
N-Q07
"L" over J800 will prevent
degradation.
NOTE
N-Q07
None.
NOTE
N-P20
"J" over M751 will prevent
degradation.
NOTE
68P80401P03-O