Toshiba MMW-AP0481CHQ-E Service Manual page 102

Hot water module high temperature type
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No.
Part to be replaced
7
IPDU P.C. Board
(MCC-1705)
(4) Heatsink
Work procedure
1. Detachment
1) Carry out the detachment of item 1 .
2) Carry out the detachment of item 3 .
3) Carry out the detachment of item 6 .
4) Remove the screws for the IPDU box cover.
(M4 × 8, 4 pcs.)
5) Remove the lead wires connected to the IPDU
P.C. Board.
Power supply terminal (2P : Red and White)
CN805 .... I/F P.C. Board (5P : Blue)
CH20 .... Reactor (1P : White)
CH21 .... Reactor (1P : White)
Ground wire (Black wire)
6) Remove below parts in the following order.
(1) Screw A (4 pcs.) → (2) Cover →
(3) Screw B (3 pcs.) → (4) Heatsink
7) Remove the following parts from the IPDU P.C.
Board, and attach them to a Service P.C. Board.
(5) Ferrite core 1 (1 pcs.), (6) Ferrite core 2 (1 pcs.),
(7) Spacer (2 pcs.)
2. Attachment
1) Apply thermal grease to sub-Heat sink of Service
P.C. board.
2) Attach Service P.C. board and Heat sink.
3) Carry out installation by following the detachment
procedure in reverse.
Silicone Thermal Grease use one of the following
• Momentive Performance Materiais "TIG1000"
• Dow Cornig Toray "SC102"
• Mizutani Electric Ind "HSC1000"
• Shin-Etsu Chemical "G-746" or "G-747"
(3) Screw B
(7) Spacer
(1) Screw A
(1) Screw A
The back side of
heat insulation
Apply thermal grease
between sub-Heatsink
and Heatsink.
Sub-heatsink
– 102 –
Remarks
IPDU P.C. Board (MCC-1705)
Screw
Screw
IPDU box cover
Viewing from the rear side
(6) Ferrite Core2
(5) Ferrite Core 1
(1) Screw A
The back side of
heat insulation
(2) Cover
Screw
(1) Screw A

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