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Hardware Reference Manual
GFK-3014F
Section 1:
A Computer-On-Module (COM) is a module containing all components
necessary for a bootable host computer packaged as a super component.
A COM requires a carrier board to connect I/O and power up. COMs are
used to build modular solutions and offer Original Equipment
Manufacturer (OEMs) fast time-to-market with reduced development
cost. Like integrated circuits, they provide OEMs with significant freedom
in meeting form-fit-function requirements. For these reasons, the COM
methodology has gained much popularity with OEMs in the embedded
industry.
The RXi2-EP IPC industrial computing platform delivers compact, rugged,
mid to high performance computing and high-performance graphics
capabilities to run HMI, historian, and analytics applications for real time
control of operations. It offers the expandability of 0, 1, 2, or 4 (mini and
low profile) PCI Express (PCIe) slots and CFast storage.
The RXi2-EP IPC (NextGenIPC) is composed of the following components:
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This chapter describes features, capabilities, and compatibilities of the
RXi2-EP IPC and its components.
Overview
Overview
bCOM6L17 COM Express module based on AMD R-Series CPU
CEC09 COM Express carrier board
PERC12 (1-slot), PERC10 (2-slot) and PERC11 (4-slot) PCIe riser board
PIP24VDC power supply module
SRC SATA riser board for additional 2.5 inch mass storage devices
support
Industrial grade enclosure with heatsink for the module and carrier
components
Section 1
Feb 2023
1
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