Section 1: Overview; Figure 1-1 0-Slot Rxi2-Xp Ipc - Emerson RXi2-XP Hardware Reference Manual

Hardware Reference Manual
GFK-3022E
Overview
Section 1:
A Computer-On-Module (COM) is a module containing all components necessary for a bootable
host computer, packaged as a super component. A COM requires a carrier board to connect I/O
and power up. COMs are used to build modular solutions and offer Original Equipment
Manufacturer (OEMs) fast time-to-market with reduced development cost. Like integrated
circuits, they provide OEMs with significant freedom in meeting form-fit-function requirements.
For these reasons, the COM methodology has gained much popularity with OEMs in the
embedded industry.
The RXi2-XP IPC industrial computing platform delivers compact, rugged, mid to high
performance computing and high performance graphics capabilities to run HMI, historian, and
analytics applications for real-time control of operations. It offers the expandability of 0, 1, 2, or
4 (mini and low profile) PCI Express (PCIe) slots and CFast storage.
The RXi2-XP IPC (NextGenIPC) is composed of the following components:
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T his chapter describes features, capabilities, and compatibilities of the RXi2-XP IPC and its
components
Figure 1-1
Overview
bCOM6L18 COM Express module based on Intel
and Xeon ® V5 series
CEC09 COM Express carrier board
PERC12 (1-slot), PERC10 (2-slot) and PERC11 (4-slot) PCIe riser board
PIP24VDC power supply module
SRC SATA riser board for additional 2.5 inch mass storage devices support
Industrial grade enclosure with heat sink for the module and carrier components
0-slot RXi2-XP IPC
September 2021
Skylake 6 Generation Core™ i3/5/7
® th
Overview
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